Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Material Type Shape Length Diameter Package Cooled Attachment Method Height Off Base (Height of Fin) Thermal Resistance @ Forced Air Flow Thermal Resistance @ Natural Material Finish
GLOBAL STOCKS
BDN18-6CB/A01
RFQ
VIEW
RFQ
1,955
In-stock
CTS Thermal Management Products HEATSINK CPU W/ADHESIVE 1.81"SQ BDN Active Aluminum Top Mount Square, Pin Fins 1.810" (45.97mm) - Assorted (BGA, LGA, CPU, ASIC...) Thermal Tape, Adhesive (Included) 0.605" (15.37mm) 2.80°C/W @ 400 LFM 8.10°C/W Black Anodized