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Picture	Mfr Part #	QUANTITY		Inventory	MANUFACTURE	Description	Package	Series	Part Status	Material	Type	Shape	Length	Width	Package Cooled	Attachment Method	Height Off Base (Height of Fin)	Power Dissipation @ Temperature Rise	Thermal Resistance @ Forced Air Flow	Thermal Resistance @ Natural	Material Finish
GLOBAL STOCKS
	834100T00000	RFQ VIEW	PDF RFQ	3,874 In-stock	Comair Rotron	HEATSINK STAMP 22.9X8X10.2MM		-	Obsolete	Copper	Top Mount	Rectangular, Fins	0.315" (8.00mm)	0.900" (22.86mm)	TO-252 (DPak)	SMD Pad	0.400" (10.16mm)	2.5W @ 35°C	17.50°C/W @ 300 LFM	-	Tin
	ATS-PCBT1095	RFQ VIEW	PDF RFQ	631 In-stock	Advanced Thermal Solutions Inc.	HEATSINK TO-252 D-PAK COPPER		-	Active	Copper	Top Mount	Rectangular, Fins	0.315" (8.00mm)	0.842" (21.40mm)	TO-252 (DPak)	-	0.400" (10.16mm)	-	21.00°C/W @ 200 LFM	28.00°C/W	Tin
	573100D00010G	RFQ VIEW	PDF RFQ	979 In-stock	Aavid, Thermal Division of Boyd Corporation	HEATSINK SMT D-PAK/TO-252 TIN		-	Active	Copper	Top Mount	Rectangular, Fins	0.315" (8.00mm)	0.900" (22.86mm)	TO-252 (DPak)	SMD Pad	0.400" (10.16mm)	0.8W @ 30°C	12.50°C/W @ 600 LFM	15.00°C/W	Tin
	573100D00010G	RFQ VIEW	PDF RFQ	3,136 In-stock	Aavid, Thermal Division of Boyd Corporation	HEATSINK SMT D-PAK/TO-252 TIN		-	Active	Copper	Top Mount	Rectangular, Fins	0.315" (8.00mm)	0.900" (22.86mm)	TO-252 (DPak)	SMD Pad	0.400" (10.16mm)	0.8W @ 30°C	12.50°C/W @ 600 LFM	15.00°C/W	Tin
	573100D00000G	RFQ VIEW	PDF RFQ	2,431 In-stock	Aavid, Thermal Division of Boyd Corporation	TOP MOUNT HEATSINK .4" D-PAK		-	Active	Copper	Top Mount	Rectangular, Fins	0.315" (8.00mm)	0.900" (22.86mm)	TO-252 (DPak)	SMD Pad	0.400" (10.16mm)	0.8W @ 30°C	12.50°C/W @ 600 LFM	15.00°C/W	Tin
	HSS-C52-NP-SMT-TR	RFQ VIEW	PDF RFQ	2,392 In-stock	CUI Inc.	HEAT SINK, STAMPING, TO-252, 8 X		-	Active	Copper	Top Mount	Rectangular, Fins	0.315" (8.00mm)	0.900" (22.86mm)	TO-252 (DPak)	-	0.400" (10.16mm)	2.1W @ 75°C	10.05°C/W @ 200 LFM	35.71°C/W	Tin

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