Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Material Type Shape Length Width Diameter Package Cooled Attachment Method Height Off Base (Height of Fin) Power Dissipation @ Temperature Rise Thermal Resistance @ Forced Air Flow Thermal Resistance @ Natural Material Finish
GLOBAL STOCKS
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RFQ
3,650
In-stock
Wakefield-Vette HEAT SINK FOR TO-5 PKG 260 Active Beryllium Copper Board Level Cylindrical 0.557" (14.15mm) 0.370" (9.40mm) 0.290" (7.37mm) ID TO-5 Bolt On - - - 14.00°C/W Black Ebonol
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RFQ
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RFQ
1,484
In-stock
Aavid, Thermal Division of Boyd Corporation HEATSINK - Active Aluminum Board Level Cylindrical 0.400" (10.16mm) 0.315" (8.00mm) ID 0.450" (11.43mm) TO-5 Press Fit 0.450" (11.43mm) - - 15°C/W Black Anodized
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RFQ
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RFQ
808
In-stock
Wakefield-Vette CUP CLIP TRANSISTOR C3488 REV H 260 Active Beryllium Copper Board Level Cylindrical 0.400" (10.16mm) 0.370" (9.40mm) 0.290" (7.37mm) ID TO-5 Bolt On - - - 14.00°C/W Black Ebonol
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RFQ
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RFQ
1,393
In-stock
Aavid, Thermal Division of Boyd Corporation BOARD LEVEL HEAT SINK - Active Aluminum Board Level Cylindrical - - 0.315" (8.00mm) ID, 1.250" (31.75mm) OD TO-5 Press Fit 0.400" (10.16mm) 1.8W @ 50°C 14.00°C/W @ 200 LFM 21.00°C/W Black Anodized
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RFQ
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RFQ
1,613
In-stock
Aavid, Thermal Division of Boyd Corporation BOARD LEVEL HEAT SINK - Active Aluminum Board Level Cylindrical - - 0.318" (8.07mm) ID, 0.500" (12.70mm) OD TO-5 Press Fit 0.250" (6.35mm) 1.0W @ 60°C 35.00°C/W @ 200 LFM 60.00°C/W Red Anodized
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RFQ
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RFQ
1,961
In-stock
Aavid, Thermal Division of Boyd Corporation BOARD LEVEL HEAT SINK - Active Aluminum Board Level Cylindrical - - 0.318" (8.07mm) ID, 0.500" (12.70mm) OD TO-5 Press Fit 0.375" (9.52mm) 1.8W @ 90°C 30.00°C/W @ 200 LFM 57.00°C/W Red Anodized
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RFQ
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RFQ
1,415
In-stock
Aavid, Thermal Division of Boyd Corporation BOARD LEVEL HEAT SINK - Active Aluminum Board Level Cylindrical - - 0.317" (8.05mm) ID, 0.375" (9.52mm) OD TO-5 Press Fit 0.400" (10.16mm) 1.0W @ 70°C 45.00°C/W @ 200 LFM 90.00°C/W Hard Anodized
320205B00000G
RFQ
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RFQ
3,285
In-stock
Aavid, Thermal Division of Boyd Corporation HEATSINK TO-5 1W H=.25"BLK - Active Aluminum Board Level Cylindrical - - 0.305" (7.75mm) ID, 0.500" (12.70mm) OD TO-5 Press Fit 0.250" (6.35mm) 0.6W @ 40°C 35.00°C/W @ 200 LFM 63.00°C/W Black Anodized
311505B00000G
RFQ
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RFQ
3,363
In-stock
Aavid, Thermal Division of Boyd Corporation TO-5 PUSH-ON HEATSINK - Active Aluminum Board Level Cylindrical - - 0.317" (8.05mm) ID, 0.375" (9.52mm) OD TO-5 Press Fit 0.400" (10.16mm) 1.0W @ 70°C 45.00°C/W @ 200 LFM 90.00°C/W Black Anodized
320105B00000G
RFQ
VIEW
RFQ
3,627
In-stock
Aavid, Thermal Division of Boyd Corporation TO-5 PUSH-ON HEATSINK 6.35MM - Active Aluminum Board Level Cylindrical - - 0.318" (8.07mm) ID, 0.500" (12.70mm) OD TO-5 Press Fit 0.250" (6.35mm) 0.6W @ 40°C 35.00°C/W @ 200 LFM 63.00°C/W Black Anodized
260-4T5E
RFQ
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RFQ
3,358
In-stock
Wakefield-Vette HEATSINK TO-5 EPOXY INSUL BLK 260 Active Beryllium Copper Board Level Cylindrical 0.370" (9.40mm) 0.380" (9.65mm) 0.290" (7.37mm) ID TO-5 Bolt On - - - 14.00°C/W Black Ebonol
323005B00000G
RFQ
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RFQ
1,644
In-stock
Aavid, Thermal Division of Boyd Corporation HEATSINK TO-5 2W BLK - Active Aluminum Board Level Cylindrical - - 0.318" (8.07mm) ID, 0.750" (19.05mm) OD TO-5 Press Fit 0.250" (6.35mm) 1.4W @ 70°C 35.00°C/W @ 200 LFM 56.00°C/W Black Anodized
326005B00000G
RFQ
VIEW
RFQ
3,610
In-stock
Aavid, Thermal Division of Boyd Corporation HEATSINK TO-5 1W H=.375" BLK - Active Aluminum Board Level Cylindrical - - 0.318" (8.07mm) ID, 0.500" (12.70mm) OD TO-5 Press Fit 0.375" (9.52mm) 1.8W @ 90°C 30.00°C/W @ 200 LFM 57.00°C/W Black Anodized
325705B00000G
RFQ
VIEW
RFQ
3,671
In-stock
Aavid, Thermal Division of Boyd Corporation TO-5 PUSH-ON HEATSINK 6.35MM - Active Aluminum Board Level Cylindrical - - 0.318" (8.07mm) ID, 0.500" (12.70mm) OD TO-5 Press Fit 0.250" (6.35mm) 1.0W @ 60°C 35.00°C/W @ 200 LFM 60.00°C/W Black Anodized