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4 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Material | Type | Shape | Length | Diameter | Package Cooled | Attachment Method | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Material Finish | |
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1,919
In-stock
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Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT SINK | - | Active | Aluminum | Board Level | Cylindrical | - | 0.300" (7.62mm) ID, 1.125" (28.57mm) OD | BGA | Thermal Tape, Adhesive (Not Included) | - | 1.5W @ 40°C | 8.00°C/W @ 400 LFM | Black Anodized | |||
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VIEW |
2,392
In-stock
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Wakefield-Vette | HEATSINK CPU 25MM SQ W/DBL TAPE | 625 | Active | Aluminum | Top Mount | Square, Pin Fins | 0.984" (25.00mm) | - | BGA | Adhesive | 0.450" (11.43mm) | - | 8.00°C/W @ 400 LFM | Black Anodized | |||
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VIEW |
3,886
In-stock
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Wakefield-Vette | HEAT SINK WITH THERMAL TAPE | 642 | Active | Aluminum | Top Mount | Square, Fins | 1.378" (35.00mm) | - | BGA | Thermal Tape, Adhesive (Included) | 0.350" (8.89mm) | - | 8.00°C/W @ 400 LFM | Black Anodized | |||
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VIEW |
3,621
In-stock
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Wakefield-Vette | HEATSINK CPU 25MM SQ H=.45" BLK | 625 | Active | Aluminum | Top Mount | Square, Pin Fins | 0.984" (25.00mm) | - | BGA | Thermal Tape, Adhesive (Not Included) | 0.450" (11.43mm) | - | 8.00°C/W @ 400 LFM | Black Anodized | |||
