Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Material Type Shape Length Package Cooled Attachment Method Height Off Base (Height of Fin) Power Dissipation @ Temperature Rise Thermal Resistance @ Forced Air Flow Material Finish
GLOBAL STOCKS
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RFQ
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RFQ
3,775
In-stock
Aavid, Thermal Division of Boyd Corporation BOARD LEVEL HEAT SINK - Active Aluminum Board Level Square, Fins 0.655" (16.64mm) BGA Thermal Tape, Adhesive (Not Included) 0.265" (6.73mm) 1.0W @ 40°C 17.50°C/W @ 300 LFM Black Anodized
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RFQ
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RFQ
1,162
In-stock
Aavid, Thermal Division of Boyd Corporation BOARD LEVEL HEAT SINK - Active Aluminum Board Level Square 0.790" (20.07mm) BGA Thermal Tape, Adhesive (Not Included) 0.155" (3.94mm) 1.0W @ 40°C 20.00°C/W @ 200 LFM Black Anodized