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| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Material | Type | Shape | Diameter | Package Cooled | Attachment Method | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Material Finish | |
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Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT SINK | - | Active | Aluminum | Board Level | Cylindrical | 0.300" (7.62mm) ID, 1.125" (28.57mm) OD | BGA | Thermal Tape, Adhesive (Not Included) | 1.5W @ 40°C | 8.00°C/W @ 400 LFM | Black Anodized | |||
