- Manufacture :
- Package Cooled :
- Attachment Method :
- Power Dissipation @ Temperature Rise :
- Thermal Resistance @ Forced Air Flow :
- Thermal Resistance @ Natural :
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8 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Material | Type | Shape | Length | Width | Diameter | Package Cooled | Attachment Method | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | ||||||||||||||||||||||
|
VIEW |
904
In-stock
|
Assmann WSW Components | HEATSINK CPU W/ADHESIVE STAMPED | - | Active | Aluminum Alloy | Top Mount | Square, Fins | 1.457" (37.00mm) | 1.457" (37.00mm) | - | Assorted (BGA, LGA, CPU, ASIC...) | Thermal Tape, Adhesive (Not Included) | 0.551" (14.00mm) | - | - | - | Natural Anodized | |||
|
|
VIEW |
908
In-stock
|
Assmann WSW Components | HEATSINK CPU W/ADHESIVE STAMPED | - | Active | Aluminum Alloy | Top Mount | Square, Fins | 1.457" (37.00mm) | 1.457" (37.00mm) | - | Assorted (BGA, LGA, CPU, ASIC...) | Thermal Tape, Adhesive (Not Included) | 0.551" (14.00mm) | - | - | - | Natural Anodized | |||
|
VIEW |
2,199
In-stock
|
CUI Inc. | HEAT SINK, EXTRUSION,TO-220, 38. | HSE | Active | Aluminum Alloy | Board Level, Vertical | Rectangular, Fins | 1.500" (38.10mm) | 1.260" (32.00mm) | - | TO-220 | PC Pin | 0.551" (14.00mm) | 6.5W @ 75°C | 3.62°C/W @ 200 LFM | 11.54°C/W | Black Anodized | |||
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|
VIEW |
2,170
In-stock
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Assmann WSW Components | FINGER-SHAPED-HEATSINK 8K/W | - | Active | Aluminum Alloy | Board Level | Square, Fins | 1.457" (37.00mm) | 1.457" (37.00mm) | - | - | Thermal Tape, Adhesive (Not Included) | 0.551" (14.00mm) | - | - | - | Natural Anodized | |||
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|
VIEW |
1,950
In-stock
|
Assmann WSW Components | HEATSINK CPU STAMPED | - | Active | Aluminum Alloy | Top Mount | Square, Fins | 1.457" (37.00mm) | 1.457" (37.00mm) | - | Assorted (BGA, LGA, CPU, ASIC...) | Thermal Tape, Adhesive (Not Included) | 0.551" (14.00mm) | - | - | - | Natural Anodized | |||
|
|
VIEW |
2,003
In-stock
|
Assmann WSW Components | HEATSINK CPU STAMPED | - | Active | Aluminum Alloy | Top Mount | Square, Fins | 1.457" (37.00mm) | 1.457" (37.00mm) | - | Assorted (BGA, LGA, CPU, ASIC...) | Thermal Tape, Adhesive (Not Included) | 0.551" (14.00mm) | - | - | - | Natural Anodized | |||
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|
VIEW |
3,580
In-stock
|
Assmann WSW Components | HEATSINK ALUM ANOD | - | Active | Aluminum Alloy | Board Level, Vertical | Square, Fins | 1.457" (37.00mm) | 1.457" (37.00mm) | - | TO-220 | Thermal Tape, Adhesive (Not Included) | 0.551" (14.00mm) | - | - | - | Natural Anodized | |||
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|
VIEW |
3,665
In-stock
|
CUI Inc. | HEAT SINK, EXTRUSION, TO-220, 25 | HSE | Active | Aluminum Alloy | Board Level, Vertical | Rectangular, Fins | 1.000" (25.40mm) | 1.260" (32.00mm) | - | TO-220 | PC Pin | 0.551" (14.00mm) | 5.7W @ 75°C | 7.74°C/W @ 200 LFM | 13.16°C/W | Black Anodized | |||
