Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Material Type Shape Length Width Package Cooled Attachment Method Height Off Base (Height of Fin) Power Dissipation @ Temperature Rise Thermal Resistance @ Forced Air Flow Thermal Resistance @ Natural Material Finish
GLOBAL STOCKS
832700T00000
RFQ
VIEW
RFQ
2,432
In-stock
Comair Rotron HEATSINK STAMP 26.2X12.7X9.9MM - Obsolete Copper Top Mount Rectangular, Fins 0.500" (12.70mm) 1.031" (26.20mm) TO-263 (D²Pak) SMD Pad 0.390" (9.91mm) 1.3W @ 30°C 10.00°C/W @ 200 LFM - Tin
Default Photo
RFQ
VIEW
RFQ
3,874
In-stock
Comair Rotron HEATSINK STAMP 22.9X8X10.2MM - Obsolete Copper Top Mount Rectangular, Fins 0.315" (8.00mm) 0.900" (22.86mm) TO-252 (DPak) SMD Pad 0.400" (10.16mm) 2.5W @ 35°C 17.50°C/W @ 300 LFM - Tin
8256BPT00000
RFQ
VIEW
RFQ
2,410
In-stock
Comair Rotron HEATSINK STAMP 25.4X12.7X30MM - Obsolete Copper Board Level, Vertical Rectangular, Fins 1.180" (29.97mm) 1.000" (25.40mm) TO-220 Bolt On and PC Pin 0.500" (12.70mm) 1.0W @ 20°C 6.00°C/W @ 300 LFM - Black Paint
Default Photo
RFQ
VIEW
RFQ
2,446
In-stock
Comair Rotron HEATSINK STAMP 25.9X15X9.5MM - Obsolete Copper Board Level Rectangular, Fins 0.590" (15.00mm) 1.020" (25.91mm) TO-263 (D²Pak) SMD Pad 0.375" (9.52mm) 2.0W @ 40°C 5.00°C/W @ 400 LFM - Tin
Default Photo
RFQ
VIEW
RFQ
1,746
In-stock
Comair Rotron HEATSINK STAMP 19.4X25.4X11.4MM - Obsolete Copper Board Level Rectangular, Fins 0.763" (19.38mm) 1.000" (25.40mm) TO-263 (D²Pak) SMD Pad 0.450" (11.43mm) 1.5W @ 20°C 4.00°C/W @ 200 LFM - Tin
825600T00000
RFQ
VIEW
RFQ
2,521
In-stock
Comair Rotron HEATSINK STAMP 25.4X12.7X30MM - Obsolete Copper Board Level, Vertical Rectangular, Fins 1.180" (29.97mm) 1.000" (25.40mm) TO-220 Bolt On and PC Pin 0.500" (12.70mm) 1.0W @ 20°C 6.00°C/W @ 300 LFM - Tin
833802T00000
RFQ
VIEW
RFQ
2,020
In-stock
Comair Rotron HEATSINK STAMP 13.1X13.2X24MM - Obsolete Copper Board Level, Vertical Rectangular, Fins 0.848" (21.55mm) 0.520" (13.21mm) TO-220 Clip and PC Pin 0.515" (13.08mm) 0.5W @ 20°C 12.00°C/W @ 500 LFM - Tin
833702T00000
RFQ
VIEW
RFQ
2,933
In-stock
Comair Rotron HEATSINK STAMP 9.5X22X28MM - Obsolete Copper Board Level, Vertical Rectangular, Fins 1.100" (27.94mm) 0.866" (22.00mm) TO-220 Clip and PC Pin 0.375" (9.52mm) 1.5W @ 40°C 8.00°C/W @ 400 LFM - Tin
Default Photo
RFQ
VIEW
RFQ
2,100
In-stock
t-Global Technology PH3 222X165X0.21MM W/ADH PH3 Active Copper Heat Spreader Rectangular, Fins 8.740" (222.00mm) 6.496" (165.00mm) Assorted (BGA, LGA, CPU, ASIC...) Adhesive 0.008" (0.21mm) - - - Polyester
Default Photo
RFQ
VIEW
RFQ
3,084
In-stock
Aavid, Thermal Division of Boyd Corporation BOARD LEVEL HEAT SINK - Active Copper Board Level, Vertical Rectangular, Fins 1.025" (26.04mm) 1.005" (25.53mm) TO-218 Clip and PC Pin 0.610" (15.49mm) 0.5W @ 20°C 4.00°C/W @ 500 LFM 23.10°C/W Tin
Default Photo
RFQ
VIEW
RFQ
3,310
In-stock
Aavid, Thermal Division of Boyd Corporation BOARD LEVEL HEAT SINK - Active Copper Board Level, Vertical Rectangular, Fins 0.795" (20.19mm) 0.915" (23.24mm) Multiwatt, SIP Clip and PC Pin 0.380" (9.65mm) 1.0W @ 30°C 6.00°C/W @ 600 LFM 16.00°C/W Tin
ATS-PCBT1095
RFQ
VIEW
RFQ
631
In-stock
Advanced Thermal Solutions Inc. HEATSINK TO-252 D-PAK COPPER - Active Copper Top Mount Rectangular, Fins 0.315" (8.00mm) 0.842" (21.40mm) TO-252 (DPak) - 0.400" (10.16mm) - 21.00°C/W @ 200 LFM 28.00°C/W Tin
ATS-PCB1061
RFQ
VIEW
RFQ
1,737
In-stock
Advanced Thermal Solutions Inc. HEATSINK TRIPLE TO-126 COPPER - Active Copper Board Level, Vertical Rectangular, Fins 1.759" (44.68mm) 1.750" (44.45mm) TO-126 Clip and Board Mounts 0.400" (10.16mm) - 6.50°C/W @ 200 LFM 15.00°C/W Tin
ATS-PCB1059
RFQ
VIEW
RFQ
2,339
In-stock
Advanced Thermal Solutions Inc. HEATSINK TO-220 COPPER W/TAB - Active Copper Board Level, Vertical Rectangular, Fins 1.250" (31.75mm) 0.875" (22.22mm) TO-220 Bolt On and Board Mounts 0.250" (6.35mm) - 8.80°C/W @ 200 LFM 24.00°C/W Tin
342940
RFQ
VIEW
RFQ
3,780
In-stock
Aavid, Thermal Division of Boyd Corporation COPPER HEATSINK 38.5X37.6X14MM - Active Copper Top Mount Rectangular, Fins 1.480" (37.59mm) 1.516" (38.50mm) BGA Push Pin 0.551" (14.00mm) - 2.60°C/W @ 200 LFM 15.90°C/W AavSHIELD 3C
Default Photo
RFQ
VIEW
RFQ
1,503
In-stock
Aavid, Thermal Division of Boyd Corporation BOARD LEVEL HEAT SINK - Active Copper Board Level, Vertical Rectangular, Fins 1.025" (26.04mm) 1.005" (25.53mm) TO-220 Clip and PC Pin 0.610" (15.49mm) 1.5W @ 40°C 5.00°C/W @ 500 LFM 20.00°C/W Tin
ATS-PCB1063
RFQ
VIEW
RFQ
1,001
In-stock
Advanced Thermal Solutions Inc. HEATSINK TO-220 COPPER W/TAB - Active Copper Board Level, Vertical Rectangular, Fins 1.180" (29.97mm) 1.000" (25.40mm) TO-220 Bolt On and Board Mounts 0.500" (12.70mm) - 13.00°C/W @ 200 LFM 18.00°C/W Tin
ATS-PCB1062
RFQ
VIEW
RFQ
863
In-stock
Advanced Thermal Solutions Inc. HEATSINK TO-220 COPPER W/TAB - Active Copper Board Level, Vertical Rectangular, Fins 1.180" (29.97mm) 1.000" (25.40mm) TO-220 Bolt On and Board Mounts 0.500" (12.70mm) - 7.00°C/W @ 200 LFM 13.00°C/W Tin
Default Photo
RFQ
VIEW
RFQ
2,298
In-stock
Aavid, Thermal Division of Boyd Corporation BOARD LEVEL HEATSINK .375" D2PAK - Active Copper Top Mount Rectangular, Fins 0.590" (15.00mm) 1.020" (25.91mm) TO-263 (D²Pak), PowerSO-10 (MO-184), SO-10 SMD Pad 0.375" (9.52mm) 2.0W @ 40°C 5.00°C/W @ 400 LFM - Tin
Default Photo
RFQ
VIEW
RFQ
2,080
In-stock
Aavid, Thermal Division of Boyd Corporation BOARD LEVEL HEAT SINK - Active Copper Board Level Rectangular, Fins 1.040" (26.42mm) 0.866" (22.00mm) TO-220 Clip 0.375" (9.52mm) 3.5W @ 70°C 7.00°C/W @ 500 LFM 19.20°C/W Tin
Default Photo
RFQ
VIEW
RFQ
3,466
In-stock
Aavid, Thermal Division of Boyd Corporation BOARD LEVEL HEAT SINK - Active Copper Board Level, Vertical Rectangular, Fins 1.180" (29.97mm) 1.000" (25.40mm) TO-220 Bolt On and PC Pin 0.500" (12.70mm) 1.0W @ 20°C 5.00°C/W @ 400 LFM 13.00°C/W Tin
Default Photo
RFQ
VIEW
RFQ
2,995
In-stock
Aavid, Thermal Division of Boyd Corporation BOARD LEVEL HEAT SINK - Active Copper Board Level Rectangular, Fins 0.700" (17.78mm) 0.900" (22.86mm) TO-220 Clip and PC Pin 0.375" (9.52mm) 1.5W @ 50°C 10.00°C/W @ 200 LFM 20.80°C/W Tin
Default Photo
RFQ
VIEW
RFQ
3,153
In-stock
Aavid, Thermal Division of Boyd Corporation BOARD LEVEL HEAT SINK - Active Copper Board Level, Vertical Rectangular, Fins 0.750" (19.05mm) 0.520" (13.21mm) TO-220 Bolt On and PC Pin 0.375" (9.52mm) 0.6W @ 30°C 5.00°C/W @ 700 LFM 35.70°C/W Tin
Default Photo
RFQ
VIEW
RFQ
3,937
In-stock
Aavid, Thermal Division of Boyd Corporation BOARD LEVEL HEAT SINK - Active Copper Board Level, Vertical Rectangular, Fins 0.848" (21.55mm) 0.900" (22.86mm) TO-220 Clip and PC Pin 0.375" (9.52mm) 1.5W @ 50°C 10.00°C/W @ 200 LFM 20.80°C/W Tin
HSS-C2591-SMT-TR
RFQ
VIEW
RFQ
2,839
In-stock
CUI Inc. HEAT SINK, STAMPING, TO-263, 14. - Active Copper Top Mount Rectangular, Fins 0.590" (15.00mm) 1.020" (25.91mm) TO-263 (D²Pak) - 0.375" (9.52mm) 2.1W @ 75°C 8.15°C/W @ 200 LFM 35.71°C/W Tin
HSS-C2540-SMT-TR
RFQ
VIEW
RFQ
3,896
In-stock
CUI Inc. HEAT SINK, STAMPING, TO-263, 19. - Active Copper Board Level Rectangular, Fins 0.763" (19.38mm) 1.000" (25.40mm) TO-220 - 0.450" (11.43mm) 3.8W @ 75°C 5.50°C/W @ 200 LFM 21.90°C/W Tin
HSS-C2540-SMT-TR
RFQ
VIEW
RFQ
1,848
In-stock
CUI Inc. HEAT SINK, STAMPING, TO-263, 19. - Active Copper Board Level Rectangular, Fins 0.763" (19.38mm) 1.000" (25.40mm) TO-220 - 0.450" (11.43mm) 3.8W @ 75°C 5.50°C/W @ 200 LFM 21.90°C/W Tin
HSS-C2540-SMT-TR
RFQ
VIEW
RFQ
1,735
In-stock
CUI Inc. HEAT SINK, STAMPING, TO-263, 19. - Active Copper Board Level Rectangular, Fins 0.763" (19.38mm) 1.000" (25.40mm) TO-220 - 0.450" (11.43mm) 3.8W @ 75°C 5.50°C/W @ 200 LFM 21.90°C/W Tin
ATS-PCB1058
RFQ
VIEW
RFQ
2,787
In-stock
Advanced Thermal Solutions Inc. HEATSINK TO-220 COPPER W/TAB - Active Copper Board Level, Vertical Rectangular, Fins 1.250" (31.75mm) 0.875" (22.22mm) TO-220 Bolt On and Board Mounts 0.250" (6.35mm) - 8.80°C/W @ 200 LFM 24.00°C/W Tin
ATS-PCB1074
RFQ
VIEW
RFQ
1,586
In-stock
Advanced Thermal Solutions Inc. HEATSINK TO-263 COPPER - Active Copper Top Mount Rectangular, Fins 0.500" (12.70mm) 1.031" (26.20mm) TO-263 (D²Pak) - 0.401" (10.20mm) - 9.50°C/W @ 200 LFM 18.00°C/W Tin