Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Material Type Shape Length Width Diameter Package Cooled Attachment Method Height Off Base (Height of Fin) Power Dissipation @ Temperature Rise Thermal Resistance @ Forced Air Flow Thermal Resistance @ Natural Material Finish
GLOBAL STOCKS
822802B00000
RFQ
VIEW
RFQ
3,488
In-stock
Comair Rotron HEATSINK STAMP 17.8X44.5X9.5MM - Obsolete Aluminum Board Level Rectangular, Fins 0.700" (17.78mm) 1.750" (44.45mm) - TO-220 Bolt On 0.375" (9.52mm) 2.0W @ 40°C 5.00°C/W @ 500 LFM - Black Anodized
Default Photo
RFQ
VIEW
RFQ
2,446
In-stock
Comair Rotron HEATSINK STAMP 25.9X15X9.5MM - Obsolete Copper Board Level Rectangular, Fins 0.590" (15.00mm) 1.020" (25.91mm) - TO-263 (D²Pak) SMD Pad 0.375" (9.52mm) 2.0W @ 40°C 5.00°C/W @ 400 LFM - Tin
658-25ABT4
RFQ
VIEW
RFQ
1,681
In-stock
Wakefield-Vette HEATSINK CPU 28MM SQ BLK W/TAPE 658 Obsolete Aluminum Top Mount Square, Pin Fins 1.100" (27.94mm) 1.100" (27.94mm) - BGA Thermal Tape, Adhesive (Included) 0.250" (6.35mm) 2.0W @ 40°C 5.00°C/W @ 500 LFM - Black Anodized
658-25ABT2
RFQ
VIEW
RFQ
3,939
In-stock
Wakefield-Vette HEATSINK CPU 28MM SQ BLK W/TAPE 658 Obsolete Aluminum Top Mount Square, Pin Fins 1.100" (27.94mm) 1.100" (27.94mm) - BGA Thermal Tape, Adhesive (Included) 0.250" (6.35mm) 2.0W @ 40°C 5.00°C/W @ 500 LFM - Black Anodized
658-25ABT1
RFQ
VIEW
RFQ
1,263
In-stock
Wakefield-Vette HEATSINK CPU 28MM SQ BLK W/TAPE 658 Obsolete Aluminum Top Mount Square, Pin Fins 1.100" (27.94mm) 1.100" (27.94mm) - BGA Thermal Tape, Adhesive (Included) 0.250" (6.35mm) 2.0W @ 40°C 5.00°C/W @ 500 LFM - Black Anodized
Default Photo
RFQ
VIEW
RFQ
1,181
In-stock
CTS Thermal Management Products HEATSINK VERT .85"H BLACK TO-220 7 Obsolete Aluminum Board Level Rectangular, Fins 0.700" (17.78mm) 0.780" (19.81mm) - TO-220 Bolt On 0.850" (21.60mm) 2.0W @ 40°C - 26.00°C/W Black Anodized