Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Material Type Shape Length Width Diameter Package Cooled Attachment Method Height Off Base (Height of Fin) Power Dissipation @ Temperature Rise Thermal Resistance @ Forced Air Flow Thermal Resistance @ Natural Material Finish
GLOBAL STOCKS
832700T00000
RFQ
VIEW
RFQ
2,432
In-stock
Comair Rotron HEATSINK STAMP 26.2X12.7X9.9MM - Obsolete Copper Top Mount Rectangular, Fins 0.500" (12.70mm) 1.031" (26.20mm) - TO-263 (D²Pak) SMD Pad 0.390" (9.91mm) 1.3W @ 30°C 10.00°C/W @ 200 LFM - Tin
Default Photo
RFQ
VIEW
RFQ
3,874
In-stock
Comair Rotron HEATSINK STAMP 22.9X8X10.2MM - Obsolete Copper Top Mount Rectangular, Fins 0.315" (8.00mm) 0.900" (22.86mm) - TO-252 (DPak) SMD Pad 0.400" (10.16mm) 2.5W @ 35°C 17.50°C/W @ 300 LFM - Tin
8256BPT00000
RFQ
VIEW
RFQ
2,410
In-stock
Comair Rotron HEATSINK STAMP 25.4X12.7X30MM - Obsolete Copper Board Level, Vertical Rectangular, Fins 1.180" (29.97mm) 1.000" (25.40mm) - TO-220 Bolt On and PC Pin 0.500" (12.70mm) 1.0W @ 20°C 6.00°C/W @ 300 LFM - Black Paint
Default Photo
RFQ
VIEW
RFQ
2,446
In-stock
Comair Rotron HEATSINK STAMP 25.9X15X9.5MM - Obsolete Copper Board Level Rectangular, Fins 0.590" (15.00mm) 1.020" (25.91mm) - TO-263 (D²Pak) SMD Pad 0.375" (9.52mm) 2.0W @ 40°C 5.00°C/W @ 400 LFM - Tin
Default Photo
RFQ
VIEW
RFQ
1,746
In-stock
Comair Rotron HEATSINK STAMP 19.4X25.4X11.4MM - Obsolete Copper Board Level Rectangular, Fins 0.763" (19.38mm) 1.000" (25.40mm) - TO-263 (D²Pak) SMD Pad 0.450" (11.43mm) 1.5W @ 20°C 4.00°C/W @ 200 LFM - Tin
825600T00000
RFQ
VIEW
RFQ
2,521
In-stock
Comair Rotron HEATSINK STAMP 25.4X12.7X30MM - Obsolete Copper Board Level, Vertical Rectangular, Fins 1.180" (29.97mm) 1.000" (25.40mm) - TO-220 Bolt On and PC Pin 0.500" (12.70mm) 1.0W @ 20°C 6.00°C/W @ 300 LFM - Tin
833802T00000
RFQ
VIEW
RFQ
2,020
In-stock
Comair Rotron HEATSINK STAMP 13.1X13.2X24MM - Obsolete Copper Board Level, Vertical Rectangular, Fins 0.848" (21.55mm) 0.520" (13.21mm) - TO-220 Clip and PC Pin 0.515" (13.08mm) 0.5W @ 20°C 12.00°C/W @ 500 LFM - Tin
833702T00000
RFQ
VIEW
RFQ
2,933
In-stock
Comair Rotron HEATSINK STAMP 9.5X22X28MM - Obsolete Copper Board Level, Vertical Rectangular, Fins 1.100" (27.94mm) 0.866" (22.00mm) - TO-220 Clip and PC Pin 0.375" (9.52mm) 1.5W @ 40°C 8.00°C/W @ 400 LFM - Tin
217-36CT6
RFQ
VIEW
RFQ
900
In-stock
Wakefield-Vette HEATSINK DPAK SMT TIN PLATED 217 Obsolete Copper Top Mount Rectangular 0.740" (18.80mm) 0.600" (15.24mm) - D²Pak (TO-263), SOL-20, SOT-223, TO-220 SMD Pad 0.360" (9.14mm) 1.0W @ 55°C 16.00°C/W @ 200 LFM 55.00°C/W Tin