- Height Off Base (Height of Fin) :
- Power Dissipation @ Temperature Rise :
- Thermal Resistance @ Forced Air Flow :
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4 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Material | Type | Shape | Length | Diameter | Package Cooled | Attachment Method | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Material Finish | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | ||||||||||||||||||||
|
VIEW |
3,274
In-stock
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Wakefield-Vette | HEATSINK CPU 28MM SQBLK W/O TAPE | 658 | Active | Aluminum | Top Mount | Square, Pin Fins | 1.100" (27.94mm) | - | BGA | Thermal Tape, Adhesive (Not Included) | 0.450" (11.43mm) | 3.0W @ 50°C | 6.00°C/W @ 200 LFM | Black Anodized | |||
|
VIEW |
1,430
In-stock
|
Wakefield-Vette | HEATSINK CPU 28MM SQ BLK W/OTAPE | 658 | Active | Aluminum | Top Mount | Square, Pin Fins | 1.100" (27.94mm) | - | BGA | Thermal Tape, Adhesive (Not Included) | 0.598" (15.20mm) | 2.5W @ 30°C | 2.00°C/W @ 500 LFM | Black Anodized | |||
|
VIEW |
1,311
In-stock
|
Wakefield-Vette | HEATSINK CPU 28MM SQBLK W/O TAPE | 658 | Active | Aluminum | Top Mount | Square, Pin Fins | 1.100" (27.94mm) | - | BGA | Thermal Tape, Adhesive (Not Included) | 0.350" (8.89mm) | - | 3.00°C/W @ 800 LFM | Black Anodized | |||
|
VIEW |
3,250
In-stock
|
Wakefield-Vette | HEATSINK CPU 28MM SQ BLK | 658 | Active | Aluminum | Top Mount | Square, Pin Fins | 1.100" (27.94mm) | - | BGA | Thermal Tape, Adhesive (Not Included) | 0.250" (6.35mm) | 2.0W @ 40°C | 5.00°C/W @ 500 LFM | Black Anodized | |||
