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2 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Material | Type | Shape | Length | Width | Diameter | Package Cooled | Attachment Method | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | ||||||||||||||||||||||
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VIEW |
3,275
In-stock
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Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT SINK | - | Active | Aluminum | Top Mount | Rectangular, Fins | 1.000" (25.40mm) | 0.830" (21.08mm) | 0.316" (8.03mm) ID | TO-5 | Press Fit | 0.395" (10.03mm) | 0.6W @ 20°C | 20.00°C/W @ 400 LFM | 31.00°C/W | Black Anodized | |||
|
VIEW |
3,430
In-stock
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Assmann WSW Components | HEATSINK ANOD ALUM CPU | - | Active | Aluminum | Top Mount | Square, Pin Fins | 0.393" (10.00mm) | 0.393" (10.00mm) | - | Assorted (BGA, LGA, CPU, ASIC...) | - | 0.275" (7.00mm) | - | - | 31.00°C/W | Black Anodized | |||
