Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Material Type Shape Length Width Package Cooled Attachment Method Height Off Base (Height of Fin) Power Dissipation @ Temperature Rise Thermal Resistance @ Forced Air Flow Thermal Resistance @ Natural Material Finish
GLOBAL STOCKS
Default Photo
RFQ
VIEW
RFQ
963
In-stock
Assmann WSW Components HEATSINK CPU XCUT - Active Aluminum Alloy Top Mount Square, Pin Fins 0.335" (8.50mm) 0.335" (8.50mm) Assorted (BGA, LGA, CPU, ASIC...) Thermal Tape, Adhesive (Not Included) 0.315" (8.00mm) - - 32.00°C/W Black Anodized
V5236BP-T
RFQ
VIEW
RFQ
775
In-stock
Assmann WSW Components HEATSINK ANOD ALUM SOT-32/TO-220 - Active Aluminum Board Level, Vertical Rectangular, Fins 1.189" (30.20mm) 1.000" (25.40mm) SOT-32, TO-220 Bolt On and Board Mounts 0.315" (8.00mm) - - 18.00°C/W Black Anodized
3083
RFQ
VIEW
RFQ
1,547
In-stock
Adafruit Industries LLC ALUMINUM HEAT SINK FOR RASPBERRY - Active Aluminum Top Mount Square, Fins 0.551" (14.00mm) 0.545" (13.84mm) Raspberry Pi Thermal Tape, Adhesive (Included) 0.315" (8.00mm) - - - -
ATS-EXL71-300-R0
RFQ
VIEW
RFQ
1,496
In-stock
Advanced Thermal Solutions Inc. HEATSINK AL6063 300X37X8MM - Active Aluminum Top Mount Rectangular, Fins 11.811" (300.00mm) 1.457" (37.00mm) - Adhesive 0.315" (8.00mm) - 9.50°C/W @ 200 LFM 36.40°C/W Degreased
ATS-EXL58-300-R0
RFQ
VIEW
RFQ
3,796
In-stock
Advanced Thermal Solutions Inc. HEATSINK AL6063 300X6X8MM - Active Aluminum Top Mount Rectangular, Fins 11.811" (300.00mm) 0.236" (6.00mm) - Adhesive 0.315" (8.00mm) - 45.00°C/W @ 200 LFM 65.00°C/W Degreased
6225B-MTG
RFQ
VIEW
RFQ
1,938
In-stock
Aavid, Thermal Division of Boyd Corporation HEATSINK TO-220 TAB BLACK - Active Aluminum Board Level, Vertical Rectangular, Fins 1.070" (27.18mm) 1.024" (26.00mm) TO-220 Bolt On and PC Pin 0.315" (8.00mm) 2.0W @ 40°C 3.00°C/W @ 700 LFM 15.00°C/W Black Anodized