Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Material Type Shape Length Width Package Cooled Attachment Method Height Off Base (Height of Fin) Power Dissipation @ Temperature Rise Thermal Resistance @ Forced Air Flow Thermal Resistance @ Natural Material Finish
GLOBAL STOCKS
833802T00000
RFQ
VIEW
RFQ
2,020
In-stock
Comair Rotron HEATSINK STAMP 13.1X13.2X24MM - Obsolete Copper Board Level, Vertical Rectangular, Fins 0.848" (21.55mm) 0.520" (13.21mm) TO-220 Clip and PC Pin 0.515" (13.08mm) 0.5W @ 20°C 12.00°C/W @ 500 LFM - Tin
7142DG
RFQ
VIEW
RFQ
2,099
In-stock
Aavid, Thermal Division of Boyd Corporation HEATSINK TO-220 TIN CLIP-ON 21MM - Active Copper Board Level Rectangular, Fins 0.780" (19.81mm) 0.520" (13.21mm) TO-220 Clip and Board Locks 0.515" (13.08mm) 1.0W @ 30°C 8.00°C/W @ 400 LFM 20.30°C/W Tin
7139DG
RFQ
VIEW
RFQ
3,692
In-stock
Aavid, Thermal Division of Boyd Corporation HEATSINK TO-220 TIN CLIP-ON 13MM - Active Copper Board Level Rectangular, Fins 0.780" (19.81mm) 0.520" (13.21mm) TO-220 Clip and PC Pin 0.515" (13.08mm) 1.5W @ 50°C 8.00°C/W @ 500 LFM 28.30°C/W Tin
7141DG
RFQ
VIEW
RFQ
3,602
In-stock
Aavid, Thermal Division of Boyd Corporation BOARD LEVEL HEATSINK .515"TO-220 - Active Copper Board Level, Vertical Rectangular, Fins 0.780" (19.81mm) 0.520" (13.21mm) TO-220 Clip and PC Pin 0.515" (13.08mm) 1.0W @ 30°C 10.00°C/W @ 200 LFM 20.30°C/W Tin
7136DG
RFQ
VIEW
RFQ
1,002
In-stock
Aavid, Thermal Division of Boyd Corporation BOARD LEVEL HEATSINK .515"TO-220 - Active Copper Board Level, Vertical Rectangular, Fins 0.848" (21.55mm) 0.520" (13.21mm) TO-220 Clip and PC Pin 0.515" (13.08mm) 1.0W @ 30°C 6.00°C/W @ 500 LFM 19.70°C/W Tin