Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Material Type Shape Length Width Diameter Package Cooled Attachment Method Height Off Base (Height of Fin) Power Dissipation @ Temperature Rise Thermal Resistance @ Forced Air Flow Thermal Resistance @ Natural Material Finish
GLOBAL STOCKS
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RFQ
VIEW
RFQ
3,874
In-stock
Comair Rotron HEATSINK STAMP 22.9X8X10.2MM - Obsolete Copper Top Mount Rectangular, Fins 0.315" (8.00mm) 0.900" (22.86mm) - TO-252 (DPak) SMD Pad 0.400" (10.16mm) 2.5W @ 35°C 17.50°C/W @ 300 LFM - Tin
Default Photo
RFQ
VIEW
RFQ
1,393
In-stock
Aavid, Thermal Division of Boyd Corporation BOARD LEVEL HEAT SINK - Active Aluminum Board Level Cylindrical - - 0.315" (8.00mm) ID, 1.250" (31.75mm) OD TO-5 Press Fit 0.400" (10.16mm) 1.8W @ 50°C 14.00°C/W @ 200 LFM 21.00°C/W Black Anodized
Default Photo
RFQ
VIEW
RFQ
684
In-stock
Aavid, Thermal Division of Boyd Corporation BOARD LEVEL HEAT SINK - Active Aluminum Board Level, Vertical Rectangular, Fins 1.750" (44.45mm) 1.760" (44.70mm) - TO-220, TO-218 Bolt On and PC Pin 0.400" (10.16mm) 6.0W @ 60°C 6.00°C/W @ 400 LFM 8.80°C/W Black Anodized
Default Photo
RFQ
VIEW
RFQ
1,415
In-stock
Aavid, Thermal Division of Boyd Corporation BOARD LEVEL HEAT SINK - Active Aluminum Board Level Cylindrical - - 0.317" (8.05mm) ID, 0.375" (9.52mm) OD TO-5 Press Fit 0.400" (10.16mm) 1.0W @ 70°C 45.00°C/W @ 200 LFM 90.00°C/W Hard Anodized
ATS-PCBT1095
RFQ
VIEW
RFQ
631
In-stock
Advanced Thermal Solutions Inc. HEATSINK TO-252 D-PAK COPPER - Active Copper Top Mount Rectangular, Fins 0.315" (8.00mm) 0.842" (21.40mm) - TO-252 (DPak) - 0.400" (10.16mm) - 21.00°C/W @ 200 LFM 28.00°C/W Tin
ATS-PCB1061
RFQ
VIEW
RFQ
1,737
In-stock
Advanced Thermal Solutions Inc. HEATSINK TRIPLE TO-126 COPPER - Active Copper Board Level, Vertical Rectangular, Fins 1.759" (44.68mm) 1.750" (44.45mm) - TO-126 Clip and Board Mounts 0.400" (10.16mm) - 6.50°C/W @ 200 LFM 15.00°C/W Tin
311505B00000G
RFQ
VIEW
RFQ
3,363
In-stock
Aavid, Thermal Division of Boyd Corporation TO-5 PUSH-ON HEATSINK - Active Aluminum Board Level Cylindrical - - 0.317" (8.05mm) ID, 0.375" (9.52mm) OD TO-5 Press Fit 0.400" (10.16mm) 1.0W @ 70°C 45.00°C/W @ 200 LFM 90.00°C/W Black Anodized
ATS-PCB1051
RFQ
VIEW
RFQ
3,513
In-stock
Advanced Thermal Solutions Inc. HEATSINK 12-SIP W/TAB BLACK - Active Aluminum Board Level, Vertical Rectangular 1.700" (43.18mm) 1.250" (31.75mm) - 12-SIP Bolt On and PC Pin 0.400" (10.16mm) - 4.50°C/W @ 200 LFM 10.00°C/W Black Anodized
573100D00010G
RFQ
VIEW
RFQ
979
In-stock
Aavid, Thermal Division of Boyd Corporation HEATSINK SMT D-PAK/TO-252 TIN - Active Copper Top Mount Rectangular, Fins 0.315" (8.00mm) 0.900" (22.86mm) - TO-252 (DPak) SMD Pad 0.400" (10.16mm) 0.8W @ 30°C 12.50°C/W @ 600 LFM 15.00°C/W Tin
573100D00010G
RFQ
VIEW
RFQ
3,136
In-stock
Aavid, Thermal Division of Boyd Corporation HEATSINK SMT D-PAK/TO-252 TIN - Active Copper Top Mount Rectangular, Fins 0.315" (8.00mm) 0.900" (22.86mm) - TO-252 (DPak) SMD Pad 0.400" (10.16mm) 0.8W @ 30°C 12.50°C/W @ 600 LFM 15.00°C/W Tin
573100D00000G
RFQ
VIEW
RFQ
2,431
In-stock
Aavid, Thermal Division of Boyd Corporation TOP MOUNT HEATSINK .4" D-PAK - Active Copper Top Mount Rectangular, Fins 0.315" (8.00mm) 0.900" (22.86mm) - TO-252 (DPak) SMD Pad 0.400" (10.16mm) 0.8W @ 30°C 12.50°C/W @ 600 LFM 15.00°C/W Tin
573300D00000G
RFQ
VIEW
RFQ
701
In-stock
Aavid, Thermal Division of Boyd Corporation TOP MOUNT HEATSINK .4" D2PAK - Active Copper Top Mount Rectangular, Fins 0.500" (12.70mm) 1.030" (26.16mm) - TO-263 (D²Pak) SMD Pad 0.400" (10.16mm) 1.3W @ 30°C 8.00°C/W @ 300 LFM 18.00°C/W Tin
573300D00010G
RFQ
VIEW
RFQ
3,491
In-stock
Aavid, Thermal Division of Boyd Corporation HEATSINK D2PAK .4" HIGH SMD - Active Copper Top Mount Rectangular, Fins 0.500" (12.70mm) 1.030" (26.16mm) - TO-263 (D²Pak) SMD Pad 0.400" (10.16mm) 1.3W @ 30°C 10.00°C/W @ 200 LFM 18.00°C/W Tin
573300D00010G
RFQ
VIEW
RFQ
2,852
In-stock
Aavid, Thermal Division of Boyd Corporation HEATSINK D2PAK .4" HIGH SMD - Active Copper Top Mount Rectangular, Fins 0.500" (12.70mm) 1.030" (26.16mm) - TO-263 (D²Pak) SMD Pad 0.400" (10.16mm) 1.3W @ 30°C 10.00°C/W @ 200 LFM 18.00°C/W Tin
573300D00010G
RFQ
VIEW
RFQ
3,966
In-stock
Aavid, Thermal Division of Boyd Corporation HEATSINK D2PAK .4" HIGH SMD - Active Copper Top Mount Rectangular, Fins 0.500" (12.70mm) 1.030" (26.16mm) - TO-263 (D²Pak) SMD Pad 0.400" (10.16mm) 1.3W @ 30°C 10.00°C/W @ 200 LFM 18.00°C/W Tin
HSS-C52-NP-SMT-TR
RFQ
VIEW
RFQ
2,392
In-stock
CUI Inc. HEAT SINK, STAMPING, TO-252, 8 X - Active Copper Top Mount Rectangular, Fins 0.315" (8.00mm) 0.900" (22.86mm) - TO-252 (DPak) - 0.400" (10.16mm) 2.1W @ 75°C 10.05°C/W @ 200 LFM 35.71°C/W Tin
ATS-PCB1005
RFQ
VIEW
RFQ
1,751
In-stock
Advanced Thermal Solutions Inc. HEATSINK TO220 HOR MNT W/TAB - Active Aluminum Board Level Rectangular, Fins 0.742" (18.85mm) 0.860" (21.84mm) - TO-220 Bolt On 0.400" (10.16mm) - 11.00°C/W @ 200 LFM 23.20°C/W Black Anodized
322505B00000G
RFQ
VIEW
RFQ
3,475
In-stock
Aavid, Thermal Division of Boyd Corporation HEATSINK TO-5 .4" BLK - Active Aluminum Top Mount Cylindrical - - 0.315" (8.00mm) ID, 0.750" (19.05mm) OD TO-5 Press Fit 0.400" (10.16mm) 0.5W @ 30°C 15.00°C/W @ 400 LFM 56.00°C/W Black Anodized