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| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Material | Type | Shape | Length | Package Cooled | Attachment Method | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Material Finish | |
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Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT SINK | - | Active | Aluminum | Board Level | Square, Fins | 0.655" (16.64mm) | BGA | Thermal Tape, Adhesive (Not Included) | 0.265" (6.73mm) | 1.0W @ 40°C | 17.50°C/W @ 300 LFM | Black Anodized | |||
