- Part Status :
- Material :
- Package Cooled :
- Attachment Method :
- Height Off Base (Height of Fin) :
- Power Dissipation @ Temperature Rise :
- Thermal Resistance @ Forced Air Flow :
- Thermal Resistance @ Natural :
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8 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Material | Type | Shape | Length | Width | Package Cooled | Attachment Method | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | |||||||||||||||||||||
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VIEW |
2,439
In-stock
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Comair Rotron | HEATSINK STAMP 20X5X25MM | - | Obsolete | Aluminum | Board Level | Rectangular | 0.984" (25.00mm) | 0.787" (20.00mm) | TO-220 | Clip | 0.197" (5.00mm) | 1.5W @ 40°C | 4.00°C/W @ 500 LFM | - | Black Anodized | |||
|
VIEW |
864
In-stock
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t-Global Technology | HEATSINK CER 20X20X6MM | - | Active | Ceramic | Heat Spreader | Square, Fins | 0.787" (20.00mm) | 0.787" (20.00mm) | - | - | 0.236" (6.00mm) | - | - | - | - | |||
|
VIEW |
1,943
In-stock
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t-Global Technology | XL25 CERAMIC 20X20MM W/LI98C ADH | XL-25 | Active | Ceramic | Heat Spreader | Square | 0.787" (20.00mm) | 0.787" (20.00mm) | Assorted (BGA, LGA, CPU, ASIC...) | Thermal Tape, Adhesive (Included) | 0.085" (2.15mm) | - | - | - | - | |||
|
VIEW |
3,643
In-stock
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t-Global Technology | HEATSINK CER 20X20X6MM W/TAPE | - | Active | Ceramic | Heat Spreader | Square, Fins | 0.787" (20.00mm) | 0.787" (20.00mm) | - | Thermal Tape, Adhesive (Included) | 0.236" (6.00mm) | - | - | - | - | |||
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|
VIEW |
1,021
In-stock
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t-Global Technology | XL25 CERAMIC 20X20MM W/LI98C ADH | XL-25 | Active | Ceramic | Heat Spreader | Square | 0.787" (20.00mm) | 0.787" (20.00mm) | Assorted (BGA, LGA, CPU, ASIC...) | Thermal Tape, Adhesive (Included) | 0.089" (2.25mm) | - | - | - | - | |||
|
VIEW |
826
In-stock
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t-Global Technology | XL25 CERAMIC BOARD 20X20X2MM | XL-25 | Active | Ceramic | Heat Spreader | Square | 0.787" (20.00mm) | 0.787" (20.00mm) | Assorted (BGA, LGA, CPU, ASIC...) | - | 0.079" (2.00mm) | - | - | - | - | |||
|
VIEW |
3,466
In-stock
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Advanced Thermal Solutions Inc. | HEATSINK TO-220 BLACK | - | Active | Aluminum | Board Level | Rectangular, Angled Fins | 0.748" (19.00mm) | 0.787" (20.00mm) | TO-220 | Bolt On | 0.433" (11.00mm) | - | 20.00°C/W @ 200 LFM | 30.00°C/W | Black Anodized | |||
|
VIEW |
2,986
In-stock
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CUI Inc. | HEATSINK TO-220 3.6W ALUMINUM | - | Active | Aluminum | Top Mount | Rectangular, Fins | 0.279" (7.10mm) | 0.787" (20.00mm) | TO-220 | - | 1.000" (25.40mm) | 3.6W @ 75°C | 7.45°C/W @ 200 LFM | 20.83°C/W | Black Anodized | |||
