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4 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Material | Type | Shape | Length | Package Cooled | Attachment Method | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | ||||||||||||||||||||
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VIEW |
3,320
In-stock
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t-Global Technology | PH3 76.2X19.1X0.21MM | PH3 | Active | Copper | Heat Spreader | Rectangular | 3.000" (76.20mm) | Assorted (BGA, LGA, CPU, ASIC...) | Adhesive | 0.008" (0.21mm) | - | - | - | Polyester | |||
|
VIEW |
1,522
In-stock
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t-Global Technology | PH3N NANO 76.2X19.1X0.07MM | PH3n | Active | Copper | Heat Spreader | Rectangular | 3.000" (76.20mm) | Assorted (BGA, LGA, CPU, ASIC...) | Adhesive | 0.003" (0.07mm) | - | - | - | Polyester | |||
|
VIEW |
1,330
In-stock
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t-Global Technology | PH3N NANO 76.2X19.1X0.062MM | PH3n | Active | Copper | Heat Spreader | Rectangular | 3.000" (76.20mm) | Assorted (BGA, LGA, CPU, ASIC...) | Adhesive | 0.002" (0.06mm) | - | - | - | Polyester | |||
|
VIEW |
2,448
In-stock
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Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEATSINK .375"TO-220 | - | Active | Copper | Board Level, Vertical | Rectangular, Fins | 0.750" (19.05mm) | TO-220 | Bolt On and PC Pin | 0.375" (9.52mm) | 1.5W @ 50°C | 10.00°C/W @ 200 LFM | 25.80°C/W | Tin | |||
