- Part Status :
- Material :
- Height Off Base (Height of Fin) :
- Power Dissipation @ Temperature Rise :
- Thermal Resistance @ Forced Air Flow :
- Thermal Resistance @ Natural :
- Material Finish :
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9 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Material | Type | Shape | Length | Width | Diameter | Package Cooled | Attachment Method | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | ||||||||||||||||||||||
|
VIEW |
900
In-stock
|
Wakefield-Vette | HEATSINK DPAK SMT TIN PLATED | 217 | Obsolete | Copper | Top Mount | Rectangular | 0.740" (18.80mm) | 0.600" (15.24mm) | - | D²Pak (TO-263), SOL-20, SOT-223, TO-220 | SMD Pad | 0.360" (9.14mm) | 1.0W @ 55°C | 16.00°C/W @ 200 LFM | 55.00°C/W | Tin | |||
|
VIEW |
3,974
In-stock
|
Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT SINK | - | Active | Aluminum | Top Mount | Rectangular, Fins | 0.890" (22.61mm) | 0.600" (15.24mm) | - | 14-DIP and 16-DIP | Press Fit and PC Pin | 0.410" (10.42mm) | 1.0W @ 20°C | 12.00°C/W @ 200 LFM | 20.00°C/W | Black Anodized | |||
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|
VIEW |
837
In-stock
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Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT SINK | - | Active | Aluminum | Top Mount | Rectangular, Fins | 0.562" (14.27mm) | 0.600" (15.24mm) | - | 8-DIP | Press Fit, Slide On | 0.450" (11.43mm) | 1.0W @ 30°C | 8.00°C/W @ 500 LFM | 30.00°C/W | Black Anodized | |||
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|
VIEW |
2,108
In-stock
|
Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT SINK | - | Active | Aluminum | Top Mount | Rectangular, Fins | 0.890" (22.61mm) | 0.600" (15.24mm) | - | 14-DIP and 16-DIP | Press Fit, Slide On | 0.410" (10.42mm) | 1.0W @ 20°C | 12.00°C/W @ 200 LFM | 20.00°C/W | Black Anodized | |||
|
VIEW |
2,964
In-stock
|
Adafruit Industries LLC | ALUMINIUM HEATSINK FOR RASPBERRY | - | Active | Aluminum | Top Mount | Square, Fins | 0.600" (15.24mm) | 0.600" (15.24mm) | - | Raspberry Pi | Thermal Tape, Adhesive (Included) | 0.600" (15.24mm) | - | - | - | - | |||
|
VIEW |
3,288
In-stock
|
Aavid, Thermal Division of Boyd Corporation | HEATSINK SLIDE-ON 8-DIP | - | Active | Aluminum | Top Mount | Rectangular, Fins | 0.562" (14.27mm) | 0.600" (15.24mm) | - | 8-DIP | Press Fit, Slide On | 0.450" (11.43mm) | 1.0W @ 30°C | 8.00°C/W @ 500 LFM | 30.00°C/W | Black Anodized | |||
|
VIEW |
1,644
In-stock
|
Aavid, Thermal Division of Boyd Corporation | HEATSINK 14-16 DIP BLK ANODIZED | - | Active | Aluminum | Top Mount | Rectangular, Fins | 0.890" (22.61mm) | 0.600" (15.24mm) | - | 14-DIP and 16-DIP | Press Fit, Slide On | 0.410" (10.42mm) | 1.0W @ 20°C | 12.00°C/W @ 200 LFM | 20.00°C/W | Black Anodized | |||
|
VIEW |
1,742
In-stock
|
Wakefield-Vette | HEATSINK DPAK SMT TIN PLATED | 217 | Active | Copper | Top Mount | Rectangular, Fins | 0.740" (18.80mm) | 0.600" (15.24mm) | - | D²Pak (TO-263), SOL-20, SOT-223, TO-220 | SMD Pad | 0.360" (9.14mm) | 1.0W @ 55°C | 16.00°C/W @ 200 LFM | 55.00°C/W | Tin | |||
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|
VIEW |
2,132
In-stock
|
Wakefield-Vette | BOARD LEVEL HEAT SINKS | 217 | Active | Copper | Top Mount | Rectangular, Fins | 0.740" (18.80mm) | 0.600" (15.24mm) | - | D²Pak (TO-263), SOL-20, SOT-223, TO-220 | SMD Pad | 0.360" (9.14mm) | 1.0W @ 55°C | 16.00°C/W @ 200 LFM | 55.00°C/W | Tin | |||
