- Package Cooled :
- Power Dissipation @ Temperature Rise :
- Thermal Resistance @ Forced Air Flow :
- Thermal Resistance @ Natural :
- Applied Filters :
2 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Material | Type | Shape | Length | Width | Package Cooled | Attachment Method | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | |||||||||||||||||||||
|
VIEW |
3,084
In-stock
|
Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT SINK | - | Active | Copper | Board Level, Vertical | Rectangular, Fins | 1.025" (26.04mm) | 1.005" (25.53mm) | TO-218 | Clip and PC Pin | 0.610" (15.49mm) | 0.5W @ 20°C | 4.00°C/W @ 500 LFM | 23.10°C/W | Tin | |||
|
|
VIEW |
1,503
In-stock
|
Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT SINK | - | Active | Copper | Board Level, Vertical | Rectangular, Fins | 1.025" (26.04mm) | 1.005" (25.53mm) | TO-220 | Clip and PC Pin | 0.610" (15.49mm) | 1.5W @ 40°C | 5.00°C/W @ 500 LFM | 20.00°C/W | Tin | |||
