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5 results
Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Material | Type | Shape | Length | Width | Package Cooled | Attachment Method | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
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GLOBAL STOCKS | |||||||||||||||||||||
VIEW |
1,162
In-stock
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Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT SINK | - | Active | Aluminum | Board Level | Square | 0.790" (20.07mm) | 0.790" (20.07mm) | BGA | Thermal Tape, Adhesive (Not Included) | 0.155" (3.94mm) | 1.0W @ 40°C | 20.00°C/W @ 200 LFM | - | Black Anodized | ||||
VIEW |
3,770
In-stock
|
Assmann WSW Components | HEAT SINK ALUM DPAK TO-252 | - | Active | Copper | Top Mount | Rectangular, Fins | 0.320" (8.13mm) | 0.790" (20.07mm) | D²Pak, TO-252 | SMD Pad | 0.390" (9.91mm) | - | - | 25.00°C/W | Tin | ||||
VIEW |
2,557
In-stock
|
Assmann WSW Components | HEAT SINK ALUM DPAK TO-252 | - | Active | Copper | Top Mount | Rectangular, Fins | 0.320" (8.13mm) | 0.790" (20.07mm) | D²Pak, TO-252 | SMD Pad | 0.390" (9.91mm) | - | - | 25.00°C/W | Tin | ||||
VIEW |
1,153
In-stock
|
Assmann WSW Components | HEAT SINK ALUM DPAK TO-252 | - | Active | Copper | Top Mount | Rectangular, Fins | 0.320" (8.13mm) | 0.790" (20.07mm) | D²Pak, TO-252 | SMD Pad | 0.390" (9.91mm) | - | - | 25.00°C/W | Tin | ||||
VIEW |
3,128
In-stock
|
Assmann WSW Components | HEAT SINK ALUM DPAK TO-252 | - | Active | Copper | Top Mount | Rectangular, Fins | 0.320" (8.13mm) | 0.790" (20.07mm) | D²Pak, TO-252 | SMD Pad | 0.390" (9.91mm) | - | - | 25.00°C/W | Tin |