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5 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Material | Type | Shape | Length | Width | Package Cooled | Attachment Method | Height Off Base (Height of Fin) | Thermal Resistance @ Natural | Material Finish | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | |||||||||||||||||||
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VIEW |
3,328
In-stock
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t-Global Technology | XL25 CERAMIC 10X10MM W/LI98C ADH | XL-25 | Active | Ceramic | Heat Spreader | Square | 0.393" (10.00mm) | 0.393" (10.00mm) | Assorted (BGA, LGA, CPU, ASIC...) | Thermal Tape, Adhesive (Included) | 0.085" (2.15mm) | - | - | |||
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|
VIEW |
2,060
In-stock
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t-Global Technology | XL25 CERAMIC 10X10MM W/LI98C ADH | XL-25 | Active | Ceramic | Heat Spreader | Square | 0.393" (10.00mm) | 0.393" (10.00mm) | Assorted (BGA, LGA, CPU, ASIC...) | Thermal Tape, Adhesive (Included) | 0.089" (2.25mm) | - | - | |||
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VIEW |
2,433
In-stock
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t-Global Technology | XL25 CERAMIC BOARD 10X10X2MM | XL-25 | Active | Ceramic | Heat Spreader | Square | 0.393" (10.00mm) | 0.393" (10.00mm) | Assorted (BGA, LGA, CPU, ASIC...) | - | 0.079" (2.00mm) | - | - | |||
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VIEW |
3,430
In-stock
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Assmann WSW Components | HEATSINK ANOD ALUM CPU | - | Active | Aluminum | Top Mount | Square, Pin Fins | 0.393" (10.00mm) | 0.393" (10.00mm) | Assorted (BGA, LGA, CPU, ASIC...) | - | 0.275" (7.00mm) | 31.00°C/W | Black Anodized | |||
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VIEW |
2,036
In-stock
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Assmann WSW Components | HEATSINK ALUM ANOD | - | Active | Aluminum | Board Level, Vertical | Rectangular, Fins | 0.393" (10.00mm) | 0.984" (25.00mm) | TO-220 | PC Pin | 0.894" (22.71mm) | 35.20°C/W | Tin | |||
