Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Material Type Shape Length Width Diameter Package Cooled Attachment Method Height Off Base (Height of Fin) Power Dissipation @ Temperature Rise Thermal Resistance @ Forced Air Flow Material Finish
GLOBAL STOCKS
Default Photo
RFQ
VIEW
RFQ
762
In-stock
Wakefield-Vette HEATSINK 100PQFP COMPOSITE Deltem™ Active Composite Top Mount Square, Pin Fins 0.650" (16.51mm) 0.650" (16.51mm) - BGA Thermal Tape, Adhesive (Included) 0.400" (10.16mm) 2.0W @ 40°C 25.00°C/W @ 350 LFM -
Default Photo
RFQ
VIEW
RFQ
661
In-stock
Wakefield-Vette HEATSINK 100PQFP COMPOSITE Deltem™ Active Composite Top Mount Square, Pin Fins 0.650" (16.51mm) 0.650" (16.51mm) - BGA Thermal Tape, Adhesive (Included) 0.400" (10.16mm) 2.0W @ 40°C 25.00°C/W @ 350 LFM -
Default Photo
RFQ
VIEW
RFQ
1,542
In-stock
Wakefield-Vette HEATSINK 100PQFP COMPOSITE Deltem™ Active Composite Top Mount Square, Pin Fins 0.650" (16.51mm) 0.650" (16.51mm) - BGA Thermal Tape, Adhesive (Included) 0.400" (10.16mm) 2.0W @ 40°C 25.00°C/W @ 350 LFM -
Default Photo
RFQ
VIEW
RFQ
3,641
In-stock
Wakefield-Vette HEATSINK 100PQFP COMPOSITE Deltem™ Active Composite Top Mount Square, Pin Fins 0.650" (16.51mm) 0.650" (16.51mm) - BGA Thermal Tape, Adhesive (Included) 0.400" (10.16mm) 2.0W @ 40°C 25.00°C/W @ 350 LFM -
LTN20069
RFQ
VIEW
RFQ
3,288
In-stock
Wakefield-Vette HEAT SINK BGA/PGA 16.5X16.5X8.9 Penguin Active Aluminum Board Level Square, Fins 0.650" (16.51mm) 0.653" (16.59mm) - Assorted (BGA, LGA, CPU, ASIC...) Thermal Tape, Adhesive (Included) 0.350" (8.89mm) - 8.00°C/W @ 500 LFM Black Anodized
D10650-40
RFQ
VIEW
RFQ
3,968
In-stock
Wakefield-Vette HEATSINK 100PQFP COMPOSITE Deltem™ Active Composite Top Mount Square, Pin Fins 0.650" (16.51mm) 0.650" (16.51mm) - BGA Thermal Tape, Adhesive (Not Included) 0.400" (10.16mm) 2.0W @ 40°C 25.00°C/W @ 350 LFM -