Picture	Mfr Part #	QUANTITY		Inventory	MANUFACTURE	Description	Series	Part Status	Packaging	Technology	Operating Temperature	Mounting Type	Package / Case	Supplier Device Package	FET Type	FET Feature	Drain to Source Voltage (Vdss)	Current - Continuous Drain (Id) @ 25°C	Rds On (Max) @ Id, Vgs	Vgs(th) (Max) @ Id	Gate Charge (Qg) (Max) @ Vgs	Input Capacitance (Ciss) (Max) @ Vds	Drive Voltage (Max Rds On, Min Rds On)	Vgs (Max)
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	EPC2016	RFQ VIEW	PDF RFQ	3,148 In-stock	EPC	TRANS GAN 100V 11A BUMPED DIE	eGaN®	Discontinued at Digi-Key	Cut Tape (CT)	GaNFET (Gallium Nitride)	-40°C ~ 125°C (TJ)	Surface Mount	Die	Die	N-Channel	-	100V	11A (Ta)	16 mOhm @ 11A, 5V	2.5V @ 3mA	5.2nC @ 5V	520pF @ 50V	5V	+6V, -5V
	EPC2037ENGR	RFQ VIEW	PDF RFQ	3,652 In-stock	EPC	TRANS GAN 100V BUMPED DIE	eGaN®	Discontinued at Digi-Key	Cut Tape (CT)	GaNFET (Gallium Nitride)	-40°C ~ 150°C (TJ)	Surface Mount	Die	Die	N-Channel	-	100V	1A (Ta)	550 mOhm @ 100mA, 5V	2.5V @ 80µA	0.12nC @ 5V	12.5pF @ 50V	5V	+6V, -4V
	EPC2032ENGRT	RFQ VIEW	PDF RFQ	1,506 In-stock	EPC	TRANS GAN 100V 48A BUMPED DIE	eGaN®	Discontinued at Digi-Key	Cut Tape (CT)	GaNFET (Gallium Nitride)	-40°C ~ 150°C (TJ)	Surface Mount	Die	Die	N-Channel	-	100V	48A (Ta)	4 mOhm @ 30A, 5V	2.5V @ 11mA	15nC @ 5V	1530pF @ 50V	5V	+6V, -4V
	EPC2038ENGR	RFQ VIEW	PDF RFQ	2,999 In-stock	EPC	TRANS GAN 100V 0.5A BUMPED DIE	eGaN®	Discontinued at Digi-Key	Cut Tape (CT)	GaNFET (Gallium Nitride)	-40°C ~ 150°C (TJ)	Surface Mount	Die	Die	N-Channel	-	100V	500mA (Ta)	3.3 Ohm @ 50mA, 5V	2.5V @ 20µA	0.044nC @ 5V	8.4pF @ 50V	5V	+6V, -4V
	EPC2001	RFQ VIEW	PDF RFQ	3,125 In-stock	EPC	TRANS GAN 100V 25A BUMPED DIE	eGaN®	Discontinued at Digi-Key	Cut Tape (CT)	GaNFET (Gallium Nitride)	-40°C ~ 125°C (TJ)	Surface Mount	Die	Die Outline (11-Solder Bar)	N-Channel	-	100V	25A (Ta)	7 mOhm @ 25A, 5V	2.5V @ 5mA	10nC @ 5V	950pF @ 50V	5V	+6V, -5V