Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Technology Operating Temperature Mounting Type Package / Case Supplier Device Package FET Type FET Feature Drain to Source Voltage (Vdss) Current - Continuous Drain (Id) @ 25°C Rds On (Max) @ Id, Vgs Vgs(th) (Max) @ Id Gate Charge (Qg) (Max) @ Vgs Input Capacitance (Ciss) (Max) @ Vds Drive Voltage (Max Rds On, Min Rds On) Vgs (Max)
GLOBAL STOCKS
EPC8004
RFQ
VIEW
RFQ
2,071
In-stock
EPC TRANS GAN 40V 2.7A BUMPED DIE eGaN® Active Cut Tape (CT) GaNFET (Gallium Nitride) -40°C ~ 150°C (TJ) Surface Mount Die Die N-Channel - 40V 2.7A (Ta) 110 mOhm @ 500mA, 5V 2.5V @ 250µA 0.45nC @ 5V 52pF @ 20V 5V +6V, -4V
EPC2024
RFQ
VIEW
RFQ
1,034
In-stock
EPC MOSFET NCH 40V 60A DIE eGaN® Active Cut Tape (CT) GaNFET (Gallium Nitride) -40°C ~ 150°C (TJ) Surface Mount Die Die N-Channel - 40V 60A (Ta) 1.5 mOhm @ 37A, 5V 2.5V @ 19mA - 2100pF @ 20V 5V +6V, -4V
EPC2030ENGRT
RFQ
VIEW
RFQ
3,424
In-stock
EPC MOSFET NCH 40V 31A DIE eGaN® Active Cut Tape (CT) GaNFET (Gallium Nitride) -40°C ~ 150°C (TJ) Surface Mount Die Die N-Channel - 40V 31A (Ta) 2.4 mOhm @ 30A, 5V 2.5V @ 16mA 18nC @ 5V 1900pF @ 20V 5V +6V, -4V
EPC2049ENGRT
RFQ
VIEW
RFQ
2,866
In-stock
EPC TRANS GAN 40V BUMPED DIE eGaN® Active Cut Tape (CT) GaNFET (Gallium Nitride) -40°C ~ 150°C (TJ) Surface Mount Die Die N-Channel - 40V 16A (Ta) 5 mOhm @ 15A, 5V 2.5V @ 6mA 7.6nC @ 5V 805pF @ 20V 5V +6V, -4V
EPC2015C
RFQ
VIEW
RFQ
2,806
In-stock
EPC TRANS GAN 40V 33A BUMPED DIE eGaN® Active Cut Tape (CT) GaNFET (Gallium Nitride) -40°C ~ 150°C (TJ) Surface Mount Die Die N-Channel - 40V 53A (Ta) 4 mOhm @ 33A, 5V 2.5V @ 9mA 8.7nC @ 5V 1000pF @ 20V 5V +6V, -4V
EPC2014C
RFQ
VIEW
RFQ
1,635
In-stock
EPC TRANS GAN 40V 10A BUMPED DIE eGaN® Active Cut Tape (CT) GaNFET (Gallium Nitride) -40°C ~ 150°C (TJ) Surface Mount Die Die Outline (5-Solder Bar) N-Channel - 40V 10A (Ta) 16 mOhm @ 10A, 5V 2.5V @ 2mA 2.5nC @ 5V 300pF @ 20V 5V +6V, -4V