Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Mounting Type Package / Case Supplier Device Package Diode Type Current - Average Rectified (Io) Voltage - Forward (Vf) (Max) @ If Current - Reverse Leakage @ Vr Voltage - DC Reverse (Vr) (Max) Speed Reverse Recovery Time (trr) Operating Temperature - Junction
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892
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Infineon Technologies DIODE GEN PURP 600V 200A WAFER - Discontinued at Digi-Key Bulk Surface Mount Die Sawn on foil Standard 200A (DC) 1.25V @ 200A 27µA @ 600V 600V Standard Recovery >500ns, > 200mA (Io) - -55°C ~ 150°C
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1,927
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Infineon Technologies DIODE GEN PURP 600V 150A WAFER - Discontinued at Digi-Key Bulk Surface Mount Die Sawn on foil Standard 150A (DC) 1.25V @ 150A 27µA @ 600V 600V Standard Recovery >500ns, > 200mA (Io) - -55°C ~ 150°C
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1,072
In-stock
Infineon Technologies DIODE GEN PURP 600V 100A WAFER - Discontinued at Digi-Key Bulk Surface Mount Die Sawn on foil Standard 100A (DC) 1.25V @ 100A 27µA @ 600V 600V Standard Recovery >500ns, > 200mA (Io) - -55°C ~ 150°C
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1,199
In-stock
Infineon Technologies DIODE GEN PURP 600V 75A WAFER - Discontinued at Digi-Key Bulk Surface Mount Die Sawn on foil Standard 75A (DC) 1.25V @ 75A 27µA @ 600V 600V Standard Recovery >500ns, > 200mA (Io) - -55°C ~ 150°C
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901
In-stock
Infineon Technologies DIODE GEN PURP 600V 50A WAFER - Discontinued at Digi-Key Bulk Surface Mount Die Sawn on foil Standard 50A (DC) 1.25V @ 50A 27µA @ 600V 600V Standard Recovery >500ns, > 200mA (Io) - -55°C ~ 150°C
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2,245
In-stock
Infineon Technologies DIODE GEN PURP 600V 50A WAFER - Discontinued at Digi-Key Bulk Surface Mount Die Sawn on foil Standard 50A (DC) 1.25V @ 50A 27µA @ 600V 600V Standard Recovery >500ns, > 200mA (Io) - -55°C ~ 150°C
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3,632
In-stock
Infineon Technologies DIODE GEN PURP 600V 30A WAFER - Discontinued at Digi-Key Bulk Surface Mount Die Sawn on foil Standard 30A (DC) 1.25V @ 30A 27µA @ 600V 600V Standard Recovery >500ns, > 200mA (Io) - -55°C ~ 150°C
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627
In-stock
Infineon Technologies DIODE GEN PURP 600V 30A WAFER - Discontinued at Digi-Key Bulk Surface Mount Die Sawn on foil Standard 30A (DC) 1.25V @ 30A 27µA @ 600V 600V Standard Recovery >500ns, > 200mA (Io) - -55°C ~ 150°C
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1,874
In-stock
Infineon Technologies DIODE GEN PURP 600V 20A WAFER - Discontinued at Digi-Key Bulk Surface Mount Die Sawn on foil Standard 20A (DC) 1.7V @ 20A 27µA @ 600V 600V Fast Recovery = 200mA (Io) 150ns -55°C ~ 150°C
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3,404
In-stock
Infineon Technologies DIODE GEN PURP 600V 20A WAFER - Discontinued at Digi-Key Bulk Surface Mount Die Sawn on foil Standard 20A (DC) 1.7V @ 20A 27µA @ 600V 600V Fast Recovery = 200mA (Io) 150ns -55°C ~ 150°C
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2,600
In-stock
Infineon Technologies DIODE GEN PURP 600V 20A WAFER - Discontinued at Digi-Key Bulk Surface Mount Die Sawn on foil Standard 20A (DC) 1.7V @ 20A 27µA @ 600V 600V Fast Recovery = 200mA (Io) 150ns -55°C ~ 150°C
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3,244
In-stock
Infineon Technologies DIODE GEN PURP 600V 10A WAFER - Discontinued at Digi-Key Bulk Surface Mount Die Sawn on foil Standard 10A (DC) 1.25V @ 10A 27µA @ 600V 600V Standard Recovery >500ns, > 200mA (Io) - -55°C ~ 150°C