Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Mounting Type Package / Case Supplier Device Package Diode Type Current - Average Rectified (Io) Voltage - Forward (Vf) (Max) @ If Current - Reverse Leakage @ Vr Voltage - DC Reverse (Vr) (Max) Speed Reverse Recovery Time (trr) Operating Temperature - Junction Capacitance @ Vr, F
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2,809
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Infineon Technologies DIODE GEN PURP 1.7KV 150A WAFER - Discontinued at Digi-Key Bulk Surface Mount Die Sawn on foil Standard 150A (DC) 1.8V @ 150A 27µA @ 1700V 1700V Standard Recovery >500ns, > 200mA (Io) - -55°C ~ 150°C -
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3,659
In-stock
Infineon Technologies DIODE GEN PURP 1.7KV 150A WAFER - Discontinued at Digi-Key Bulk Surface Mount Die Sawn on foil Standard 150A (DC) 1.8V @ 150A 27µA @ 1700V 1700V Standard Recovery >500ns, > 200mA (Io) - -55°C ~ 150°C -
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950
In-stock
Infineon Technologies DIODE GEN PURP 1.7KV 100A WAFER - Discontinued at Digi-Key Bulk Surface Mount Die Sawn on foil Standard 100A (DC) 2.15V @ 100A 27µA @ 1700V 1700V Standard Recovery >500ns, > 200mA (Io) - -40°C ~ 175°C -
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889
In-stock
Infineon Technologies DIODE GEN PURP 1.7KV 100A WAFER - Discontinued at Digi-Key Bulk Surface Mount Die Sawn on foil Standard 100A (DC) 1.8V @ 100A 27µA @ 1700V 1700V Standard Recovery >500ns, > 200mA (Io) - -55°C ~ 150°C -
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2,236
In-stock
Infineon Technologies DIODE GEN PURP 1.7KV 75A WAFER - Discontinued at Digi-Key Bulk Surface Mount Die Sawn on foil Standard 75A (DC) 2.15V @ 75A 27µA @ 1700V 1700V Standard Recovery >500ns, > 200mA (Io) - -40°C ~ 150°C -
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1,814
In-stock
Infineon Technologies DIODE GEN PURP 1.7KV 75A WAFER - Discontinued at Digi-Key Bulk Surface Mount Die Sawn on foil Standard 75A (DC) 1.8V @ 75A 27µA @ 1700V 1700V Standard Recovery >500ns, > 200mA (Io) - -55°C ~ 150°C -
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985
In-stock
Infineon Technologies DIODE GEN PURP 1.7KV 50A WAFER - Discontinued at Digi-Key Bulk Surface Mount Die Sawn on foil Standard 50A (DC) 2.15V @ 50A 27µA @ 1700V 1700V Standard Recovery >500ns, > 200mA (Io) - -40°C ~ 150°C -
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RFQ
3,579
In-stock
Infineon Technologies DIODE GEN PURP 1.7KV 50A WAFER - Discontinued at Digi-Key Bulk Surface Mount Die Sawn on foil Standard 50A (DC) 1.8V @ 50A 27µA @ 1700V 1700V Standard Recovery >500ns, > 200mA (Io) - -55°C ~ 150°C -
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2,515
In-stock
Infineon Technologies DIODE GEN PURP 1.7KV 300A WAFER - Discontinued at Digi-Key Bulk Surface Mount Die Sawn on foil Standard 300A (DC) 1.8V @ 300A 27µA @ 1700V 1700V Standard Recovery >500ns, > 200mA (Io) - -55°C ~ 150°C -
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2,720
In-stock
Infineon Technologies DIODE GEN PURP 1.7KV 200A WAFER - Discontinued at Digi-Key Bulk Surface Mount Die Sawn on foil Standard 200A (DC) 1.8V @ 200A 27µA @ 1700V 1700V Standard Recovery >500ns, > 200mA (Io) - -55°C ~ 150°C -
CPW3-1700-S025B-WP
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2,052
In-stock
Cree/Wolfspeed DIODE SILICON 1.7KV 25A CHIP Z-Rec® Active - Surface Mount Die Sawn on foil Silicon Carbide Schottky 25A 2V @ 25A 100µA @ 1700V 1700V No Recovery Time > 500mA (Io) 0ns -55°C ~ 175°C 2250pF @ 0V, 1MHz
CPW3-1700-S010B-WP
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1,790
In-stock
Cree/Wolfspeed DIODE SILICON 1.7KV 10A CHIP Z-Rec® Active - Surface Mount Die Sawn on foil Silicon Carbide Schottky 10A 2V @ 10A 50µA @ 1700V 1700V No Recovery Time > 500mA (Io) 0ns -55°C ~ 175°C 880pF @ 0V, 1MHz