Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Number of Positions or Pins (Grid) Contact Material - Mating
GLOBAL STOCKS
2-382714-1
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RFQ
2,279
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 20POS TIN Diplomate DL Obsolete Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic, Glass Filled 0.100" (2.54mm) Tin - 20 (2 x 10) Beryllium Copper
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RFQ
1,989
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 20POS GOLD Diplomate DL Obsolete Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic 0.100" (2.54mm) Gold 30.0µin (0.76µm) 20 (2 x 10) Beryllium Copper
2-641612-1
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RFQ
2,582
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 20POS TIN Diplomate DL Obsolete Tube -55°C ~ 105°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic 0.100" (2.54mm) Tin - 20 (2 x 10) Beryllium Copper
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RFQ
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RFQ
1,701
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 20POS GOLD Diplomate DL Obsolete Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 20 (2 x 10) Beryllium Copper
1-1825093-6
RFQ
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RFQ
2,005
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 20POS GOLD Diplomate DL Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 20 (2 x 10) Beryllium Copper
2-641264-1
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RFQ
3,365
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 20POS TIN Diplomate DL Active Tube -55°C ~ 105°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic, Glass Filled 0.100" (2.54mm) Tin - 20 (2 x 10) Beryllium Copper