Contact Finish - Post :
Contact Finish Thickness - Post :
Contact Material - Post :
Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
GLOBAL STOCKS
110-91-950-41-001000
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RFQ
1,160
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 50POS GOLD 110 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.9" (22.86mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 50 (2 x 25) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
110-91-432-41-001000
RFQ
VIEW
RFQ
1,477
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 32POS GOLD 110 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 32 (2 x 16) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
110-11-624-41-001000
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VIEW
RFQ
1,124
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 24POS GOLD 110 Active Tube - Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 24 (2 x 12) Beryllium Copper 10.0µin (0.25µm) Brass Alloy
110-91-624-41-001000
RFQ
VIEW
RFQ
2,510
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 24POS GOLD 110 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 24 (2 x 12) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
110-91-424-41-001000
RFQ
VIEW
RFQ
1,282
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 24POS GOLD 110 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 24 (2 x 12) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
110-91-324-41-001000
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VIEW
RFQ
1,641
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 24POS GOLD 110 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 24 (2 x 12) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
110-91-964-41-001000
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VIEW
RFQ
2,109
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 64POS GOLD 110 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.9" (22.86mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 64 (2 x 32) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
110-91-952-41-001000
RFQ
VIEW
RFQ
1,824
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 52POS GOLD 110 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.9" (22.86mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 52 (2 x 26) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
Default Photo
RFQ
VIEW
RFQ
1,703
In-stock
Samtec Inc. DIP SOCKETS ICA Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyester, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 32 (2 x 16) Beryllium Copper - Brass
110-91-642-41-001000
RFQ
VIEW
RFQ
2,690
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 42POS GOLD 110 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 42 (2 x 21) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
110-91-640-41-001000
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VIEW
RFQ
1,859
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 40POS GOLD 110 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 40 (2 x 20) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
110-91-632-41-001000
RFQ
VIEW
RFQ
1,962
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 32POS GOLD 110 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 32 (2 x 16) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
110-91-648-41-001000
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VIEW
RFQ
2,638
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 48POS GOLD 110 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 48 (2 x 24) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
110-91-306-41-001000
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VIEW
RFQ
3,731
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 6POS GOLD 110 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 6 (2 x 3) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
110-91-650-41-001000
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VIEW
RFQ
1,407
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 50POS GOLD 110 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 50 (2 x 25) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
110-91-210-41-001000
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VIEW
RFQ
2,944
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 10POS GOLD 110 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.2" (5.08mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 10 (2 x 5) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
Default Photo
RFQ
VIEW
RFQ
1,774
In-stock
Harwin Inc. CONN IC DIP SOCKET 32POS GOLD D26 Active Tube -55°C ~ 125°C Through Hole Press-Fit Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 32 (2 x 16) Beryllium Copper 196.9µin (5.00µm) Brass
110-91-310-41-001000
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VIEW
RFQ
1,719
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 10POS GOLD 110 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 10 (2 x 5) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
Default Photo
RFQ
VIEW
RFQ
634
In-stock
Harwin Inc. CONN IC DIP SOCKET 28POS GOLD D26 Active Tube -55°C ~ 125°C Through Hole Press-Fit Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 28 (2 x 14) Beryllium Copper 196.9µin (5.00µm) Brass
110-91-428-41-001000
RFQ
VIEW
RFQ
1,115
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 28POS GOLD 110 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 28 (2 x 14) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
110-91-328-41-001000
RFQ
VIEW
RFQ
1,343
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 28POS GOLD 110 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 28 (2 x 14) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
Default Photo
RFQ
VIEW
RFQ
3,567
In-stock
CNC Tech CONN IC DIP SOCKET 32POS GOLD - Active Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polybutylene Terephthalate (PBT) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 32 (2 x 16) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
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VIEW
RFQ
1,119
In-stock
CNC Tech CONN IC DIP SOCKET 8POS GOLD - Active Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polybutylene Terephthalate (PBT) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 8 (2 x 4) Beryllium Copper 200.0µin (5.08µm) Brass
110-91-316-41-001000
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VIEW
RFQ
3,447
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 16POS GOLD 110 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 16 (2 x 8) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
Default Photo
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VIEW
RFQ
688
In-stock
Samtec Inc. CONN IC DIP SOCKET 40POS GOLD ICA Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyester 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 40 (2 x 20) Beryllium Copper 10.0µin (0.25µm) Beryllium Copper
110-91-314-41-001000
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VIEW
RFQ
2,697
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 14POS GOLD 110 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 14 (2 x 7) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
110-91-308-41-001000
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VIEW
RFQ
3,977
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 8POS GOLD 110 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 8 (2 x 4) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
14-3518-101
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VIEW
RFQ
2,039
In-stock
Aries Electronics CONN IC DIP SOCKET 14POS GOLD 518 Active Tube - Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 14 (2 x 7) Beryllium Copper 200.0µin (5.08µm) Brass
AR 28 HZL/01-TT
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VIEW
RFQ
2,676
In-stock
Assmann WSW Components CONN IC DIP SOCKET 28POS GOLD - Active Tube -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 28 (2 x 14) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
AR 24 HZL/01/7-TT
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VIEW
RFQ
1,163
In-stock
Assmann WSW Components CONN IC DIP SOCKET 24POS GOLD - Active Tube -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 24 (2 x 12) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper