Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
GLOBAL STOCKS
299-83-632-10-002101
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1,274
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Preci-Dip CONN IC DIP SOCKET 32POS GOLD 299 Active Tube -55°C ~ 125°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 32 (2 x 16) Beryllium Copper - Brass
6-1437536-3
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1,462
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 32POS GOLD 500 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing - 0.100" (2.54mm) Gold - - 32 (2 x 16) Beryllium Copper - Brass
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3,135
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 32POS TIN 500 Active Tube -55°C ~ 105°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Tin - Tin 32 (2 x 16) Beryllium Copper - Nickel
210-99-632-41-001000
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2,322
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 32POS TINLEAD 210 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Tin-Lead 100.0µin (2.54µm) Tin-Lead 32 (2 x 16) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
5-1571551-0
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RFQ
3,681
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 32POS GOLD 500 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) Gold 32 (2 x 16) Beryllium Copper 25.0µin (0.63µm) Nickel
210-13-632-41-001000
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2,574
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 32POS GOLD 210 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 32 (2 x 16) Beryllium Copper 10.0µin (0.25µm) Brass Alloy
299-93-632-10-002000
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RFQ
2,574
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 32POS GOLD 299 Active Tube -55°C ~ 125°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 32 (2 x 16) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
299-87-632-10-002101
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RFQ
1,421
In-stock
Preci-Dip CONN IC DIP SOCKET 32POS GOLD 299 Active Tube -55°C ~ 125°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold Flash Tin 32 (2 x 16) Beryllium Copper - Brass
214-44-632-01-670800
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RFQ
2,665
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 32POS TIN 214 Active Tube -55°C ~ 125°C Surface Mount Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Tin 100.0µin (2.54µm) Tin 32 (2 x 16) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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RFQ
911
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 32POS GOLD 500 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold Flash Gold 32 (2 x 16) Beryllium Copper Flash Nickel
299-43-632-10-002000
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RFQ
2,046
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 32POS GOLD 299 Active Tube -55°C ~ 125°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 32 (2 x 16) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
532-AG11D-ES
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RFQ
876
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 32POS GOLD 500 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing - 0.100" (2.54mm) Gold - - 32 (2 x 16) Beryllium Copper - Brass
1-1571550-0
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RFQ
3,882
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 32POS TIN 500 Active Tube -55°C ~ 105°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Tin - Tin 32 (2 x 16) Beryllium Copper - Beryllium Copper
210-93-632-41-001000
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VIEW
RFQ
2,392
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 32POS GOLD 210 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 32 (2 x 16) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
214-99-632-01-670800
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RFQ
2,533
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 32POS TINLEAD 214 Active Tube -55°C ~ 125°C Surface Mount Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Tin-Lead 100.0µin (2.54µm) Tin-Lead 32 (2 x 16) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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RFQ
1,579
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 32POS GOLD 210 Active Tube -55°C ~ 125°C Surface Mount Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold Flash Tin 32 (2 x 16) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
6-1437532-1
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VIEW
RFQ
911
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 32POS GOLD 500 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) Gold 32 (2 x 16) Beryllium Copper 25.0µin (0.63µm) Beryllium Copper
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RFQ
796
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 32POS TINLEAD 500 Active Tube -55°C ~ 105°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing - 0.100" (2.54mm) Tin-Lead - - 32 (2 x 16) Beryllium Copper - Brass
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RFQ
2,875
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 32POS GOLD 500 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) Gold 32 (2 x 16) Beryllium Copper 25.0µin (0.63µm) Beryllium Copper
210-43-632-41-001000
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VIEW
RFQ
2,503
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 32POS GOLD 210 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 32 (2 x 16) Beryllium Copper 200.0µin (5.08µm) Brass Alloy