Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
GLOBAL STOCKS
2-640379-4
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1,057
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 40POS GOLD Diplomate DL Obsolete Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic, Glass Filled 0.100" (2.54mm) Gold 15.0µin (0.38µm) Gold 40 (2 x 20) Phosphor Bronze 15.0µin (0.38µm) Phosphor Bronze
4-382568-0
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RFQ
3,410
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 40POS TIN Diplomate DL Obsolete Tube -55°C ~ 105°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic, Glass Filled 0.100" (2.54mm) Tin - Tin 40 (2 x 20) Phosphor Bronze - Phosphor Bronze
1825108-3
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RFQ
3,809
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 40POS GOLD Diplomate DL Obsolete Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic, Glass Filled 0.100" (2.54mm) Gold 15.0µin (0.38µm) Gold 40 (2 x 20) Phosphor Bronze 15.0µin (0.38µm) Phosphor Bronze
2-641268-1
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RFQ
1,821
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 40POS TIN Diplomate DL Obsolete Tube -55°C ~ 105°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic, Glass Filled 0.100" (2.54mm) Tin - Tin 40 (2 x 20) Beryllium Copper - Beryllium Copper
2-641268-4
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RFQ
3,499
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 40POS GOLD Diplomate DL Obsolete Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic, Glass Filled 0.100" (2.54mm) Gold 15.0µin (0.38µm) Gold 40 (2 x 20) Phosphor Bronze 15.0µin (0.38µm) Phosphor Bronze
299-43-640-10-002000
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RFQ
1,165
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 40POS GOLD 299 Active Tube -55°C ~ 125°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 40 (2 x 20) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
1-1825108-3
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RFQ
3,445
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 40POS GOLD Diplomate DL Obsolete Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 40 (2 x 20) Beryllium Copper 30.0µin (0.76µm) Beryllium Copper
210-13-640-41-001000
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RFQ
2,192
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 40POS GOLD 210 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 40 (2 x 20) Beryllium Copper 10.0µin (0.25µm) Brass Alloy
210-99-640-41-001000
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RFQ
1,359
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 40POS TINLEAD 210 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Tin-Lead 100.0µin (2.54µm) Tin-Lead 40 (2 x 20) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
299-87-640-10-002101
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RFQ
3,901
In-stock
Preci-Dip CONN IC DIP SOCKET 40POS GOLD 299 Active Tube -55°C ~ 125°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold Flash Tin 40 (2 x 20) Beryllium Copper - Brass
299-83-640-10-002101
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RFQ
2,145
In-stock
Preci-Dip CONN IC DIP SOCKET 40POS GOLD 299 Active Tube -55°C ~ 125°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 40 (2 x 20) Beryllium Copper - Brass
Default Photo
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RFQ
866
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 40POS GOLD 500 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) Gold 40 (2 x 20) Beryllium Copper 25.0µin (0.63µm) Beryllium Copper
Default Photo
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RFQ
634
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 40POS TINLEAD 500 Active Tube -55°C ~ 105°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyester 0.100" (2.54mm) Tin-Lead - Tin-Lead 40 (2 x 20) Beryllium Copper - Beryllium Copper
Default Photo
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RFQ
3,271
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 40POS TIN 500 Active Tube -55°C ~ 105°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Tin - Tin 40 (2 x 20) Beryllium Copper - Beryllium Copper
540-AG10D-ES
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RFQ
3,417
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 40POS GOLD 500 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing - 0.100" (2.54mm) Gold - - 40 (2 x 20) Beryllium Copper - Brass
210-93-640-41-001000
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RFQ
2,798
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 40POS GOLD 210 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 40 (2 x 20) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
210-43-640-41-001000
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VIEW
RFQ
1,685
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 40POS GOLD 210 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 40 (2 x 20) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
Default Photo
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RFQ
3,316
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 40POS GOLD 500 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold Flash Gold 40 (2 x 20) Beryllium Copper Flash Nickel
5-1571551-2
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RFQ
1,703
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 40POS GOLD 500 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) Gold 40 (2 x 20) Beryllium Copper 25.0µin (0.63µm) Nickel
1825375-3
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RFQ
2,655
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 40POS GOLD Diplomate DL Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic, Glass Filled 0.100" (2.54mm) Gold 15.0µin (0.38µm) Gold 40 (2 x 20) Phosphor Bronze 15.0µin (0.38µm) Phosphor Bronze
214-99-640-01-670800
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RFQ
1,420
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 40POS TINLEAD 214 Active Tube -55°C ~ 125°C Surface Mount Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Tin-Lead 100.0µin (2.54µm) Tin-Lead 40 (2 x 20) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
3-1571550-2
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RFQ
1,743
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 40POS GOLD 500 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) Gold 40 (2 x 20) Beryllium Copper 25.0µin (0.63µm) Beryllium Copper
210-47-640-41-001000
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RFQ
1,716
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 40POS GOLD 210 Active Tube -55°C ~ 125°C Surface Mount Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold Flash Tin 40 (2 x 20) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
214-44-640-01-670800
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VIEW
RFQ
3,578
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 40POS TIN 214 Active Tube -55°C ~ 125°C Surface Mount Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Tin 100.0µin (2.54µm) Tin 40 (2 x 20) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
Default Photo
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RFQ
1,457
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 40POS TIN 500 Active Tube -55°C ~ 105°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Tin - Tin 40 (2 x 20) Beryllium Copper - Nickel
Default Photo
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RFQ
1,386
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 40POS GOLD Diplomate DL Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 40 (2 x 20) Beryllium Copper 30.0µin (0.76µm) Beryllium Copper
540-AG11D-ES
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RFQ
1,905
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 40POS GOLD 500 Active Tube -55°C ~ 105°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyester 0.100" (2.54mm) Gold - Tin-Lead 40 (2 x 20) Copper Alloy - Copper Alloy
299-93-640-10-002000
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RFQ
2,471
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 40POS GOLD 299 Active Tube -55°C ~ 125°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 40 (2 x 20) Beryllium Copper 200.0µin (5.08µm) Brass Alloy