Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
GLOBAL STOCKS
1-1825094-7
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2,018
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 24POS GOLD Diplomate DL Obsolete Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 24 (2 x 12) Beryllium Copper 30.0µin (0.76µm) Beryllium Copper
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1,361
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 24POS GOLD Diplomate DL Obsolete Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 24 (2 x 12) Beryllium Copper 30.0µin (0.76µm) Beryllium Copper
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614
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 24POS GOLD Diplomate DL Obsolete Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 24 (2 x 12) Beryllium Copper 30.0µin (0.76µm) Beryllium Copper
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2,750
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 24POS GOLD - Obsolete Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) - 24 (2 x 12) Beryllium Copper - Brass
210-13-624-41-001000
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816
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 24POS GOLD 210 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 24 (2 x 12) Beryllium Copper 10.0µin (0.25µm) Brass Alloy
210-13-324-41-001000
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2,539
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 24POS GOLD 210 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 24 (2 x 12) Beryllium Copper 10.0µin (0.25µm) Brass Alloy
299-93-624-10-002000
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2,813
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 24POS GOLD 299 Active Tube -55°C ~ 125°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 24 (2 x 12) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
210-43-324-41-001000
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RFQ
3,896
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 24POS GOLD 210 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 24 (2 x 12) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
299-43-324-11-001000
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RFQ
3,226
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 24POS GOLD 299 Active Tube -55°C ~ 125°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 24 (2 x 12) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
299-93-324-11-001000
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RFQ
3,771
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 24POS GOLD 299 Active Tube -55°C ~ 125°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 24 (2 x 12) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
210-93-324-41-001000
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RFQ
3,470
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 24POS GOLD 210 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 24 (2 x 12) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
210-43-624-41-001000
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RFQ
695
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 24POS GOLD 210 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 24 (2 x 12) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
210-93-624-41-001000
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RFQ
2,665
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 24POS GOLD 210 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 24 (2 x 12) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
299-43-624-10-002000
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RFQ
1,208
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 24POS GOLD 299 Active Tube -55°C ~ 125°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 24 (2 x 12) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
299-43-324-10-001000
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RFQ
1,361
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 24POS GOLD 299 Active Tube -55°C ~ 125°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 24 (2 x 12) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
299-93-324-10-001000
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RFQ
3,483
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 24POS GOLD 299 Active Tube -55°C ~ 125°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 24 (2 x 12) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
224-1275-00-0602J
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2,739
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3M CONN IC DIP SOCKET ZIF 24POS GLD Textool™ Active Tube -55°C ~ 125°C Connector Press-Fit Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polysulfone (PSU), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 24 (2 x 12) Beryllium Copper 30.0µin (0.76µm) Beryllium Copper