Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
GLOBAL STOCKS
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1,157
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 8POS GOLD 500 Obsolete Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) Gold 8 (2 x 4) Beryllium Copper 25.0µin (0.63µm) Nickel
508-AG10D
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2,740
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 8POS GOLD 500 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing - 0.100" (2.54mm) Gold 25.0µin (0.63µm) Gold 8 (2 x 4) Copper Alloy 25.0µin (0.63µm) Copper Alloy
508-AG11D-ES
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1,394
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 8POS GOLD 500 Active Tube -55°C ~ 105°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) Tin-Lead 8 (2 x 4) Copper Alloy - Copper Alloy
2-1571550-2
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935
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 8POS GOLD 500 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) Gold 8 (2 x 4) Beryllium Copper 25.0µin (0.63µm) Beryllium Copper
508-AG10D-ES
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RFQ
2,110
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 8POS GOLD 500 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) Gold 8 (2 x 4) Copper Alloy 25.0µin (0.63µm) Copper Alloy