Contact Finish - Mating :
Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
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2,031
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 14POS TIN 500 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing - 0.100" (2.54mm) Tin - 14 (2 x 7) Beryllium Copper - Copper
299-43-640-10-002000
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1,165
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 40POS GOLD 299 Active Tube -55°C ~ 125°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 40 (2 x 20) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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3,973
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 64POS GOLD 210 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.9" (22.86mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 64 (2 x 32) Beryllium Copper 10.0µin (0.25µm) Brass Alloy
299-93-626-10-002000
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1,567
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 26POS GOLD 299 Active Tube -55°C ~ 125°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 26 (2 x 13) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
299-93-608-10-002000
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1,300
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 8POS GOLD 299 Active Tube -55°C ~ 125°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 8 (2 x 4) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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3,779
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 8POS TIN-LEAD 500 Active Tube -55°C ~ 125°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing - 0.100" (2.54mm) Tin-Lead - 8 (2 x 4) Copper Alloy - Copper Alloy
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2,536
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 64POS TINLEAD 210 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.9" (22.86mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Tin-Lead 100.0µin (2.54µm) 64 (2 x 32) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
210-13-624-41-001000
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816
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 24POS GOLD 210 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 24 (2 x 12) Beryllium Copper 10.0µin (0.25µm) Brass Alloy
210-13-324-41-001000
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2,539
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 24POS GOLD 210 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 24 (2 x 12) Beryllium Copper 10.0µin (0.25µm) Brass Alloy
210-13-640-41-001000
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2,192
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 40POS GOLD 210 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 40 (2 x 20) Beryllium Copper 10.0µin (0.25µm) Brass Alloy
210-13-314-41-001000
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1,814
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 14POS GOLD 210 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 14 (2 x 7) Beryllium Copper 10.0µin (0.25µm) Brass Alloy
210-99-640-41-001000
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1,359
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 40POS TINLEAD 210 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Tin-Lead 100.0µin (2.54µm) 40 (2 x 20) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
210-99-628-41-001000
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762
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 28POS TINLEAD 210 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Tin-Lead 100.0µin (2.54µm) 28 (2 x 14) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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2,839
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 8POS TIN-LEAD 210 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Tin-Lead 100.0µin (2.54µm) 8 (2 x 4) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
299-99-210-12-001800
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2,714
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 10POS TINLEAD 299 Active Tube -55°C ~ 125°C Through Hole, Right Angle, Vertical Solder Closed Frame DIP, 0.2" (5.08mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Tin-Lead 100.0µin (2.54µm) 10 (2 x 5) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
299-93-630-10-002000
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3,850
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 30POS GOLD 299 Active Tube -55°C ~ 125°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 30 (2 x 15) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
522-AG10D
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1,227
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 22POS GOLD 500 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing - 0.100" (2.54mm) Gold - 22 (2 x 11) Copper Alloy - Copper Alloy
299-83-632-10-002101
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1,274
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Preci-Dip CONN IC DIP SOCKET 32POS GOLD 299 Active Tube -55°C ~ 125°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) 32 (2 x 16) Beryllium Copper - Brass
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3,204
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 16POS GOLD 500 Active Tube -55°C ~ 125°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic 0.100" (2.54mm) Gold 20.0µin (0.51µm) 16 (2 x 8) Beryllium Copper - Brass
299-87-628-10-002101
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2,022
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Preci-Dip CONN IC DIP SOCKET 28POS GOLD 299 Active Tube -55°C ~ 125°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold Flash 28 (2 x 14) Beryllium Copper - Brass
299-83-624-10-002101
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2,442
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Preci-Dip CONN IC DIP SOCKET 24POS GOLD 299 Active Tube -55°C ~ 125°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) 24 (2 x 12) Beryllium Copper - Brass
299-43-620-10-002000
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3,295
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 20POS GOLD 299 Active Tube -55°C ~ 125°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 20 (2 x 10) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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1,588
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TE Connectivity AMP Connectors CONN SOCKET SIP 20POS GOLD Diplomate DL Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame SIP Thermoplastic, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 20 (1 x 20) Beryllium Copper 30.0µin (0.76µm) Beryllium Copper
299-93-620-10-002000
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973
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 20POS GOLD 299 Active Tube -55°C ~ 125°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 20 (2 x 10) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
299-87-626-10-002101
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2,544
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Preci-Dip CONN IC DIP SOCKET 26POS GOLD 299 Active Tube -55°C ~ 125°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold Flash 26 (2 x 13) Beryllium Copper - Brass
299-83-324-11-001101
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627
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Preci-Dip CONN IC DIP SOCKET 24POS GOLD 299 Active Tube -55°C ~ 125°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) 24 (2 x 12) Beryllium Copper - Brass
299-83-324-10-001101
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644
In-stock
Preci-Dip CONN IC DIP SOCKET 24POS GOLD 299 Active Tube -55°C ~ 125°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) 24 (2 x 12) Beryllium Copper - Brass
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737
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 22POS GOLD 500 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) 22 (2 x 11) Beryllium Copper 25.0µin (0.63µm) Nickel
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2,771
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 64POS GOLD 210 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.9" (22.86mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 64 (2 x 32) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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742
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Samtec Inc. CONN SOCKET PLCC 44POS GOLD PLCC Active Tube -55°C ~ 125°C Surface Mount Solder Closed Frame PLCC Liquid Crystal Polymer (LCP) 0.050" (1.27mm) Gold Flash 44 (4 x 11) Beryllium Copper - Beryllium Copper