Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Number of Positions or Pins (Grid) Contact Material - Mating Contact Material - Post
GLOBAL STOCKS
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2,864
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Omron Electronics Inc-EMC Div CONN IC DIP SOCKET 40POS GOLD XR2 Obsolete Bulk -55°C ~ 125°C Through Hole Solder Carrier DIP, 0.6" (15.24mm) Row Spacing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) 40 (2 x 20) Beryllium Copper Beryllium Copper
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1,221
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Omron Electronics Inc-EMC Div CONN IC DIP SOCKET 40POS GOLD XR2 Active Bulk -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 40 (2 x 20) Beryllium Copper Beryllium Copper
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2,301
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Omron Electronics Inc-EMC Div CONN IC DIP SOCKET 40POS GOLD XR2 Active Bulk -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 40 (2 x 20) Beryllium Copper Beryllium Copper
1-2199299-5
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3,663
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TE Connectivity AMP Connectors 40P,DIP SKT,600 CL,LDR,PB FREE Diplomate DL Active Bulk -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Tin 60.0µin (1.52µm) 40 (2 x 20) Phosphor Bronze Nickel