Contact Finish - Mating :
Contact Material - Mating :
Contact Finish Thickness - Post :
Contact Material - Post :
Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
GLOBAL STOCKS
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3,042
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Harwin Inc. CONN SOCKET SIP 16POS GOLD D01-950 Obsolete Bulk -55°C ~ 125°C Through Hole Solder Elevated SIP Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 16 (1 x 16) Beryllium Copper - Brass
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1,421
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Amphenol FCI CONN SOCKET SIP 16POS GOLD SIP1x Obsolete Bulk - Through Hole Solder Closed Frame SIP Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 16 (1 x 16) Beryllium Copper 200.0µin (5.08µm) Brass
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799
In-stock
Amphenol FCI CONN SOCKET SIP 16POS TIN SIP050-1x Obsolete Bulk - Through Hole Solder Closed Frame SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 16 (1 x 16) Beryllium Copper 200.0µin (5.08µm) Brass
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2,615
In-stock
Amphenol FCI CONN SOCKET SIP 16POS GOLD SIP050-1x Obsolete Bulk - Through Hole Solder Closed Frame SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 16 (1 x 16) Beryllium Copper 200.0µin (5.08µm) Brass
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2,434
In-stock
Amphenol FCI CONN SOCKET SIP 16POS GOLD SIP1x Obsolete Bulk - Through Hole Solder Closed Frame SIP Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 16 (1 x 16) Beryllium Copper 200.0µin (5.08µm) Brass
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1,476
In-stock
Amphenol FCI CONN SOCKET SIP 16POS TIN SIP1x Obsolete Bulk - Through Hole Solder Closed Frame SIP Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 150.0µin (3.81µm) Tin 16 (1 x 16) Beryllium Copper 200.0µin (5.08µm) Brass
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3,067
In-stock
TE Connectivity AMP Connectors CONN SOCKET SIP 16POS GOLD 500 Obsolete Bulk - Through Hole Solder - SIP Thermoplastic 0.100" (2.54mm) Gold - Gold 16 (1 x 16) Beryllium Copper - Beryllium Copper
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3,691
In-stock
TE Connectivity AMP Connectors CONN SOCKET SIP 16POS GOLD - Obsolete Bulk -55°C ~ 125°C Through Hole Solder Closed Frame SIP Thermoplastic, Polyester 0.100" (2.54mm) Gold 29.5µin (0.75µm) Gold 16 (1 x 16) Beryllium Copper 29.5µin (0.75µm) Brass
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3,429
In-stock
Aries Electronics CONN SOCKET SIP 16POS GOLD 511 Active Bulk -55°C ~ 125°C Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 16 (1 x 16) Phosphor Bronze 10.0µin (0.25µm) Phosphor Bronze
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1,873
In-stock
Aries Electronics CONN SOCKET SIP 16POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 16 (1 x 16) Beryllium Copper 10.0µin (0.25µm) Brass
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1,845
In-stock
TE Connectivity AMP Connectors CONN SOCKET SIP 16POS GOLD - Active Bulk - Through Hole Solder Closed Frame SIP Thermoplastic 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 16 (1 x 16) Beryllium Copper 10.0µin (0.25µm) Brass
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3,214
In-stock
Aries Electronics CONN SOCKET SIP 16POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 16 (1 x 16) Beryllium Copper 200.0µin (5.08µm) Brass
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3,269
In-stock
TE Connectivity AMP Connectors CONN SOCKET SIP 16POS GOLD - Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame SIP Thermoplastic, Polyester 0.100" (2.54mm) Gold Flash Tin 16 (1 x 16) Beryllium Copper 196.9µin (5.00µm) Brass
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1,394
In-stock
Harwin Inc. CONN SOCKET SIP 16POS GOLD D01-997 Active Bulk -55°C ~ 125°C Through Hole Solder - SIP Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold Flash Tin 16 (1 x 16) Beryllium Copper 196.9µin (5.00µm) Brass
714-43-116-31-018000
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2,736
In-stock
Mill-Max Manufacturing Corp. CONN SOCKET SIP 16POS GOLD 714 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 16 (1 x 16) Beryllium Copper 30.0µin (0.76µm) Brass Alloy
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812
In-stock
Aries Electronics CONN SOCKET SIP 16POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 16 (1 x 16) Beryllium Copper 200.0µin (5.08µm) Brass
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3,532
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Aries Electronics CONN SOCKET SIP 16POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 16 (1 x 16) Beryllium Copper 10.0µin (0.25µm) Brass
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2,020
In-stock
Aries Electronics CONN SOCKET SIP 16POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 16 (1 x 16) Beryllium Copper 200.0µin (5.08µm) Brass
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2,134
In-stock
Aries Electronics CONN SOCKET SIP 16POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 16 (1 x 16) Beryllium Copper 200.0µin (5.08µm) Brass
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1,038
In-stock
Aries Electronics CONN SOCKET SIP 16POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 16 (1 x 16) Beryllium Copper 200.0µin (5.08µm) Brass
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676
In-stock
Omron Electronics Inc-EMC Div CONN SOCKET SIP 16POS GOLD XR2 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame SIP Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 16 (1 x 16) Beryllium Copper 10.0µin (0.25µm) Beryllium Copper
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1,137
In-stock
Aries Electronics CONN SOCKET SIP 16POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 16 (1 x 16) Beryllium Copper 200.0µin (5.08µm) Brass
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2,791
In-stock
Aries Electronics CONN SOCKET SIP 16POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 16 (1 x 16) Beryllium Copper 10.0µin (0.25µm) Brass
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RFQ
3,607
In-stock
Aries Electronics CONN SOCKET SIP 16POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 16 (1 x 16) Beryllium Copper 200.0µin (5.08µm) Brass
317-43-116-41-005000
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RFQ
880
In-stock
Mill-Max Manufacturing Corp. CONN SOCKET 16POS .070 STR GOLD 317 Active Bulk -55°C ~ 125°C Through Hole Solder - SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.070" (1.78mm) Gold 30.0µin (0.76µm) Tin 16 (1 x 16) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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3,184
In-stock
Aries Electronics CONN SOCKET SIP 16POS TIN 700 Elevator Strip-Line™ Active Bulk -55°C ~ 105°C Through Hole Solder Elevated SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 16 (1 x 16) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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RFQ
3,996
In-stock
Aries Electronics CONN SOCKET SIP 16POS TIN 700 Elevator Strip-Line™ Active Bulk -55°C ~ 105°C Through Hole Solder Elevated SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 16 (1 x 16) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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RFQ
2,527
In-stock
Aries Electronics CONN SOCKET SIP 16POS TIN 700 Elevator Strip-Line™ Active Bulk -55°C ~ 105°C Through Hole Solder Elevated SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 16 (1 x 16) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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767
In-stock
Aries Electronics CONN SOCKET SIP 16POS TIN 700 Elevator Strip-Line™ Active Bulk -55°C ~ 105°C Through Hole Solder Elevated SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 16 (1 x 16) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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3,924
In-stock
Aries Electronics CONN SOCKET SIP 16POS TIN 700 Elevator Strip-Line™ Active Bulk -55°C ~ 105°C Through Hole Solder Elevated SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 16 (1 x 16) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze