Contact Finish - Post :
Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Pitch - Post Contact Finish Thickness - Post Contact Material - Post
GLOBAL STOCKS
Default Photo
RFQ
VIEW
RFQ
3,842
In-stock
TE Connectivity AMP Connectors CONN SOCKET PGA ZIF 989POS GOLD - Obsolete Bulk - Surface Mount Solder Open Frame PGA, ZIF (ZIP) Thermoplastic 0.039" (1.00mm) Gold 15.0µin (0.38µm) Tin-Lead 989 (35 x 36) Copper Alloy 0.039" (1.00mm) 15.0µin (0.38µm) Copper Alloy
Default Photo
RFQ
VIEW
RFQ
3,858
In-stock
TE Connectivity AMP Connectors CONN SOCKET PGA ZIF 989POS GOLD - Obsolete Bulk - Surface Mount Solder Open Frame PGA, ZIF (ZIP) Thermoplastic 0.039" (1.00mm) Gold 15.0µin (0.38µm) Tin-Lead 989 (35 x 36) Copper Alloy 0.039" (1.00mm) 15.0µin (0.38µm) Copper Alloy
Default Photo
RFQ
VIEW
RFQ
1,993
In-stock
Molex, LLC CONN SOCKET LGA 2011POS GOLD 105142 Active Bulk - Surface Mount Solder Open Frame LGA Thermoplastic 0.040" (1.02mm) Gold 15.0µin (0.38µm) - 2011 (47 x 58) Copper Alloy 0.040" (1.01mm) - Copper Alloy
Default Photo
RFQ
VIEW
RFQ
2,011
In-stock
Molex, LLC CONN SOCKET LGA 2011POS GOLD 105142 Active Bulk - Surface Mount Solder Open Frame LGA Thermoplastic 0.040" (1.02mm) Gold 30.0µin (0.76µm) - 2011 (47 x 58) Copper Alloy 0.040" (1.01mm) - -
Default Photo
RFQ
VIEW
RFQ
2,974
In-stock
Aries Electronics CONN SOCKET SIP 2POS GOLD 518 Active Bulk - Surface Mount Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 2 (1 x 2) Beryllium Copper 0.100" (2.54mm) 200.0µin (5.08µm) Brass
Default Photo
RFQ
VIEW
RFQ
3,460
In-stock
Aries Electronics CONN SOCKET SIP 34POS GOLD 518 Active Bulk - Surface Mount Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 34 (1 x 34) Beryllium Copper 0.100" (2.54mm) 200.0µin (5.08µm) Brass
Default Photo
RFQ
VIEW
RFQ
3,342
In-stock
Aries Electronics CONN SOCKET SIP 33POS GOLD 518 Active Bulk - Surface Mount Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 33 (1 x 33) Beryllium Copper 0.100" (2.54mm) 200.0µin (5.08µm) Brass
Default Photo
RFQ
VIEW
RFQ
3,897
In-stock
TE Connectivity AMP Connectors CONN SOCKET LGA 115POS LGH Active Bulk - Surface Mount Solder Open Frame LGA Polycarbonate Film - - - - 115 - - - -
Default Photo
RFQ
VIEW
RFQ
1,433
In-stock
Aries Electronics CONN SOCKET SIP 23POS GOLD 518 Active Bulk - Surface Mount Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 23 (1 x 23) Beryllium Copper 0.100" (2.54mm) 200.0µin (5.08µm) Brass
Default Photo
RFQ
VIEW
RFQ
2,664
In-stock
Aries Electronics CONN SOCKET SIP 22POS GOLD 518 Active Bulk - Surface Mount Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 22 (1 x 22) Beryllium Copper 0.100" (2.54mm) 200.0µin (5.08µm) Brass
Default Photo
RFQ
VIEW
RFQ
2,258
In-stock
Aries Electronics CONN SOCKET SIP 15POS GOLD 518 Active Bulk - Surface Mount Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 15 (1 x 15) Beryllium Copper 0.100" (2.54mm) 200.0µin (5.08µm) Brass
Default Photo
RFQ
VIEW
RFQ
1,755
In-stock
Aries Electronics CONN SOCKET SIP 14POS GOLD 518 Active Bulk - Surface Mount Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 14 (1 x 14) Beryllium Copper 0.100" (2.54mm) 200.0µin (5.08µm) Brass
Default Photo
RFQ
VIEW
RFQ
3,000
In-stock
Aries Electronics CONN SOCKET SIP 9POS GOLD 518 Active Bulk - Surface Mount Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 9 (1 x 9) Beryllium Copper 0.100" (2.54mm) 200.0µin (5.08µm) Brass
Default Photo
RFQ
VIEW
RFQ
1,734
In-stock
Aries Electronics CONN SOCKET SIP 8POS GOLD 518 Active Bulk - Surface Mount Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 8 (1 x 8) Beryllium Copper 0.100" (2.54mm) 200.0µin (5.08µm) Brass
Default Photo
RFQ
VIEW
RFQ
3,934
In-stock
TE Connectivity AMP Connectors CONN SOCKET LGA 1155POS GOLD - Active Bulk - Surface Mount Solder Open Frame LGA Thermoplastic 0.036" (0.91mm) Gold 15.0µin (0.38µm) Gold 1155 (40 x 40) Copper Alloy 0.036" (0.91mm) 15.0µin (0.38µm) Copper Alloy
Default Photo
RFQ
VIEW
RFQ
3,593
In-stock
Aries Electronics CONN SOCKET SIP 37POS GOLD 518 Active Bulk - Surface Mount Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 37 (1 x 37) Beryllium Copper 0.100" (2.54mm) 200.0µin (5.08µm) Brass
Default Photo
RFQ
VIEW
RFQ
3,924
In-stock
Aries Electronics CONN SOCKET SIP 36POS GOLD 518 Active Bulk - Surface Mount Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 36 (1 x 36) Beryllium Copper 0.100" (2.54mm) 200.0µin (5.08µm) Brass
Default Photo
RFQ
VIEW
RFQ
2,219
In-stock
Aries Electronics CONN SOCKET SIP 35POS GOLD 518 Active Bulk - Surface Mount Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 35 (1 x 35) Beryllium Copper 0.100" (2.54mm) 200.0µin (5.08µm) Brass
Default Photo
RFQ
VIEW
RFQ
1,055
In-stock
Aries Electronics CONN SOCKET SIP 4POS GOLD 518 Active Bulk - Surface Mount Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 4 (1 x 4) Beryllium Copper 0.100" (2.54mm) 200.0µin (5.08µm) Brass
Default Photo
RFQ
VIEW
RFQ
3,317
In-stock
Preci-Dip CONN SOCKET PLCC 32POS TIN 540 Active Bulk - Surface Mount Solder Board Guide, Closed Frame PLCC Polyphenylene Sulfide (PPS) 0.050" (1.27mm) Tin - Tin 32 (4 x 8) Phosphor Bronze 0.100" (2.54mm) - Phosphor Bronze
Default Photo
RFQ
VIEW
RFQ
3,322
In-stock
Preci-Dip CONN SOCKET PLCC 32POS TIN 540 Active Bulk - Surface Mount Solder Closed Frame PLCC Polyphenylene Sulfide (PPS) 0.050" (1.27mm) Tin - Tin 32 (4 x 8) Phosphor Bronze 0.100" (2.54mm) - Phosphor Bronze
Default Photo
RFQ
VIEW
RFQ
3,323
In-stock
Aries Electronics CONN SOCKET SIP 3POS GOLD 518 Active Bulk - Surface Mount Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 3 (1 x 3) Beryllium Copper 0.100" (2.54mm) 200.0µin (5.08µm) Brass
Default Photo
RFQ
VIEW
RFQ
3,709
In-stock
Aries Electronics CONN SOCKET SIP 1POS GOLD 518 Active Bulk - Surface Mount Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 1 (1 x 1) Beryllium Copper 0.100" (2.54mm) 200.0µin (5.08µm) Brass
Default Photo
RFQ
VIEW
RFQ
2,517
In-stock
Aries Electronics CONN SOCKET SIP 39POS GOLD 518 Active Bulk - Surface Mount Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 39 (1 x 39) Beryllium Copper 0.100" (2.54mm) 200.0µin (5.08µm) Brass
Default Photo
RFQ
VIEW
RFQ
763
In-stock
Aries Electronics CONN SOCKET SIP 25POS GOLD 518 Active Bulk - Surface Mount Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 25 (1 x 25) Beryllium Copper 0.100" (2.54mm) 200.0µin (5.08µm) Brass
Default Photo
RFQ
VIEW
RFQ
2,918
In-stock
TE Connectivity AMP Connectors CONN SOCKET LGA 1155POS GOLD LGH Active Bulk - Surface Mount Solder Open Frame LGA Thermoplastic 0.036" (0.91mm) Gold Flash - 1155 (40 x 40) Copper Alloy 0.039" (1.00mm) - -
Default Photo
RFQ
VIEW
RFQ
2,077
In-stock
Aries Electronics CONN SOCKET SIP 24POS GOLD 518 Active Bulk - Surface Mount Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 24 (1 x 24) Beryllium Copper 0.100" (2.54mm) 200.0µin (5.08µm) Brass
Default Photo
RFQ
VIEW
RFQ
2,269
In-stock
Aries Electronics CONN SOCKET SIP 40POS GOLD 518 Active Bulk - Surface Mount Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 40 (1 x 40) Beryllium Copper 0.100" (2.54mm) 200.0µin (5.08µm) Brass
Default Photo
RFQ
VIEW
RFQ
1,997
In-stock
Aries Electronics CONN SOCKET SIP 38POS GOLD 518 Active Bulk - Surface Mount Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 38 (1 x 38) Beryllium Copper 0.100" (2.54mm) 200.0µin (5.08µm) Brass
20-0518-00
RFQ
VIEW
RFQ
2,562
In-stock
Aries Electronics CONN SOCKET SIP 20POS GOLD 518 Active Bulk - Surface Mount Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 20 (1 x 20) Beryllium Copper 0.100" (2.54mm) 200.0µin (5.08µm) Brass