Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
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1,582
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Amphenol FCI CONN SOCKET SIP 21POS GOLD SIP050-1x Obsolete Bulk - Through Hole Solder Closed Frame SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 21 (1 x 21) Beryllium Copper 200.0µin (5.08µm) Brass
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2,489
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Amphenol FCI CONN SOCKET SIP 21POS TIN SIP050-1x Obsolete Bulk - Through Hole Solder Closed Frame SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 21 (1 x 21) Beryllium Copper 200.0µin (5.08µm) Brass
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3,300
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Amphenol FCI CONN SOCKET SIP 21POS GOLD SIP1x Obsolete Bulk - Through Hole Solder Closed Frame SIP Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 21 (1 x 21) Beryllium Copper 200.0µin (5.08µm) Brass
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2,441
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Aries Electronics CONN SOCKET SIP 21POS GOLD 508 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 21 (1 x 21) Beryllium Copper 10.0µin (0.25µm) Brass
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3,282
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Aries Electronics CONN SOCKET SIP 21POS GOLD 508 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 21 (1 x 21) Beryllium Copper 10.0µin (0.25µm) Brass
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3,529
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Aries Electronics CONN SOCKET SIP 21POS GOLD 0503 Active Bulk - Through Hole Wire Wrap - SIP Polyamide (PA), Nylon, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 21 (1 x 21) Beryllium Copper 200.0µin (5.08µm) Brass
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3,417
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Aries Electronics CONN SOCKET SIP 21POS GOLD 0503 Active Bulk - Through Hole Wire Wrap - SIP Polyamide (PA), Nylon, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 21 (1 x 21) Beryllium Copper 200.0µin (5.08µm) Brass
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1,352
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Aries Electronics CONN SOCKET SIP 21POS GOLD 0503 Active Bulk - Through Hole Wire Wrap - SIP Polyamide (PA), Nylon, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 21 (1 x 21) Beryllium Copper 10.0µin (0.25µm) Brass
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1,623
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Aries Electronics CONN SOCKET SIP 21POS GOLD 0503 Active Bulk - Through Hole Wire Wrap - SIP Polyamide (PA), Nylon, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 21 (1 x 21) Beryllium Copper 10.0µin (0.25µm) Brass
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3,143
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Aries Electronics CONN SOCKET SIP 21POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 21 (1 x 21) Beryllium Copper 10.0µin (0.25µm) Brass
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1,226
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Aries Electronics CONN SOCKET SIP 21POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 21 (1 x 21) Beryllium Copper 10.0µin (0.25µm) Brass
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2,149
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Aries Electronics CONN SOCKET SIP 21POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 21 (1 x 21) Beryllium Copper 200.0µin (5.08µm) Brass
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2,660
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Aries Electronics CONN SOCKET SIP 21POS GOLD 0517 Active Bulk - Through Hole, Right Angle Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled - Gold 30.0µin (0.76µm) Tin 21 (1 x 21) Beryllium Copper 200.0µin (5.08µm) Brass
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2,988
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Aries Electronics CONN SOCKET SIP 21POS GOLD 508 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 21 (1 x 21) Beryllium Copper 200.0µin (5.08µm) Brass
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2,853
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Aries Electronics CONN SOCKET SIP 21POS GOLD 508 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 21 (1 x 21) Beryllium Copper 200.0µin (5.08µm) Brass
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3,213
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Aries Electronics CONN SOCKET SIP 21POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 21 (1 x 21) Beryllium Copper 10.0µin (0.25µm) Brass
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1,144
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Aries Electronics CONN SOCKET SIP 21POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 21 (1 x 21) Beryllium Copper 10.0µin (0.25µm) Brass
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762
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Harwin Inc. CONN SOCKET SIP 21POS GOLD D01-997 Active Bulk -55°C ~ 125°C Through Hole Solder - SIP Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold Flash Tin 21 (1 x 21) Beryllium Copper 196.9µin (5.00µm) Brass
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2,247
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Aries Electronics CONN SOCKET SIP 21POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 21 (1 x 21) Beryllium Copper 200.0µin (5.08µm) Brass
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635
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Aries Electronics CONN SOCKET SIP 21POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 21 (1 x 21) Beryllium Copper 200.0µin (5.08µm) Brass
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2,429
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Aries Electronics CONN SOCKET SIP 21POS GOLD 518 Active Bulk - Surface Mount Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 21 (1 x 21) Beryllium Copper 200.0µin (5.08µm) Brass
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3,902
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Aries Electronics CONN SOCKET SIP 21POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 21 (1 x 21) Beryllium Copper 200.0µin (5.08µm) Brass
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3,844
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Aries Electronics CONN SOCKET SIP 21POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 21 (1 x 21) Beryllium Copper 200.0µin (5.08µm) Brass
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821
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Aries Electronics CONN SOCKET SIP 21POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 21 (1 x 21) Beryllium Copper 200.0µin (5.08µm) Brass