Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
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2,840
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Amphenol FCI CONN SOCKET SIP 29POS TIN SIP050-1x Obsolete Bulk - Through Hole Solder Closed Frame SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 29 (1 x 29) Beryllium Copper 200.0µin (5.08µm) Brass
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1,939
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Amphenol FCI CONN SOCKET SIP 29POS GOLD SIP050-1x Obsolete Bulk - Through Hole Solder Closed Frame SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 29 (1 x 29) Beryllium Copper 200.0µin (5.08µm) Brass
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3,239
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Aries Electronics CONN SOCKET SIP 29POS GOLD 508 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 29 (1 x 29) Beryllium Copper 200.0µin (5.08µm) Brass
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1,959
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Aries Electronics CONN SOCKET SIP 29POS GOLD 508 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 29 (1 x 29) Beryllium Copper 200.0µin (5.08µm) Brass
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3,387
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Aries Electronics CONN SOCKET SIP 29POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 29 (1 x 29) Beryllium Copper 10.0µin (0.25µm) Brass
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2,407
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Aries Electronics CONN SOCKET SIP 29POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 29 (1 x 29) Beryllium Copper 200.0µin (5.08µm) Brass
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3,441
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Aries Electronics CONN SOCKET SIP 29POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 29 (1 x 29) Beryllium Copper 200.0µin (5.08µm) Brass
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2,045
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Aries Electronics CONN SOCKET SIP 29POS GOLD 518 Active Bulk - Surface Mount Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 29 (1 x 29) Beryllium Copper 200.0µin (5.08µm) Brass
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3,620
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Aries Electronics CONN SOCKET SIP 29POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 29 (1 x 29) Beryllium Copper 200.0µin (5.08µm) Brass
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701
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Aries Electronics CONN SOCKET SIP 29POS GOLD 508 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 29 (1 x 29) Beryllium Copper 10.0µin (0.25µm) Brass
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1,647
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Aries Electronics CONN SOCKET SIP 29POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 29 (1 x 29) Beryllium Copper 10.0µin (0.25µm) Brass
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1,821
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Harwin Inc. CONN SOCKET SIP 29POS GOLD D01-997 Active Bulk -55°C ~ 125°C Through Hole Solder - SIP Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold Flash Tin 29 (1 x 29) Beryllium Copper 196.9µin (5.00µm) Brass