Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
GLOBAL STOCKS
Default Photo
RFQ
VIEW
RFQ
3,273
In-stock
Amphenol FCI CONN SOCKET SIP 25POS GOLD SIP050-1x Obsolete Bulk - Through Hole Solder Closed Frame SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 25 (1 x 25) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
RFQ
VIEW
RFQ
2,575
In-stock
Amphenol FCI CONN SOCKET SIP 25POS TIN SIP050-1x Obsolete Bulk - Through Hole Solder Closed Frame SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 25 (1 x 25) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
RFQ
VIEW
RFQ
3,320
In-stock
Aries Electronics CONN SOCKET SIP 25POS GOLD 508 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 25 (1 x 25) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
RFQ
VIEW
RFQ
1,109
In-stock
Aries Electronics CONN SOCKET SIP 25POS GOLD 508 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 25 (1 x 25) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
RFQ
VIEW
RFQ
2,227
In-stock
Aries Electronics CONN SOCKET SIP 25POS GOLD 508 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 25 (1 x 25) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
RFQ
VIEW
RFQ
1,136
In-stock
Aries Electronics CONN SOCKET SIP 25POS GOLD 508 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 25 (1 x 25) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
RFQ
VIEW
RFQ
3,384
In-stock
Aries Electronics CONN SOCKET SIP 25POS GOLD 0503 Active Bulk - Through Hole Wire Wrap - SIP Polyamide (PA), Nylon, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 25 (1 x 25) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
RFQ
VIEW
RFQ
1,880
In-stock
Aries Electronics CONN SOCKET SIP 25POS GOLD 0503 Active Bulk - Through Hole Wire Wrap - SIP Polyamide (PA), Nylon, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 25 (1 x 25) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
RFQ
VIEW
RFQ
909
In-stock
Aries Electronics CONN SOCKET SIP 25POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 25 (1 x 25) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
RFQ
VIEW
RFQ
2,899
In-stock
Aries Electronics CONN SOCKET SIP 25POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 25 (1 x 25) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
RFQ
VIEW
RFQ
763
In-stock
Aries Electronics CONN SOCKET SIP 25POS GOLD 518 Active Bulk - Surface Mount Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 25 (1 x 25) Beryllium Copper 200.0µin (5.08µm) Brass
25-0503-30
RFQ
VIEW
RFQ
1,923
In-stock
Aries Electronics CONN SOCKET SIP 25POS GOLD 0503 Active Bulk - Through Hole Wire Wrap - SIP Polyamide (PA), Nylon, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 25 (1 x 25) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
RFQ
VIEW
RFQ
1,390
In-stock
Aries Electronics CONN SOCKET SIP 25POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 25 (1 x 25) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
RFQ
VIEW
RFQ
1,437
In-stock
Aries Electronics CONN SOCKET SIP 25POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 25 (1 x 25) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
RFQ
VIEW
RFQ
2,865
In-stock
Aries Electronics CONN SOCKET SIP 25POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 25 (1 x 25) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
RFQ
VIEW
RFQ
1,239
In-stock
Harwin Inc. CONN SOCKET SIP 25POS GOLD D01-997 Active Bulk -55°C ~ 125°C Through Hole Solder - SIP Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold Flash Tin 25 (1 x 25) Beryllium Copper 196.9µin (5.00µm) Brass
Default Photo
RFQ
VIEW
RFQ
3,993
In-stock
Aries Electronics CONN SOCKET SIP 25POS GOLD 0503 Active Bulk - Through Hole Wire Wrap - SIP Polyamide (PA), Nylon, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 25 (1 x 25) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
RFQ
VIEW
RFQ
3,850
In-stock
Aries Electronics CONN SOCKET SIP 25POS GOLD 0517 Active Bulk - Through Hole, Right Angle Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled - Gold 30.0µin (0.76µm) Tin 25 (1 x 25) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
RFQ
VIEW
RFQ
3,965
In-stock
Aries Electronics CONN SOCKET SIP 25POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 25 (1 x 25) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
RFQ
VIEW
RFQ
2,043
In-stock
Aries Electronics CONN SOCKET SIP 25POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 25 (1 x 25) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
RFQ
VIEW
RFQ
3,206
In-stock
Aries Electronics CONN SOCKET SIP 25POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 25 (1 x 25) Beryllium Copper 200.0µin (5.08µm) Brass
25-0513-10
RFQ
VIEW
RFQ
3,923
In-stock
Aries Electronics CONN SOCKET SIP 25POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 25 (1 x 25) Beryllium Copper 200.0µin (5.08µm) Brass