Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
GLOBAL STOCKS
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2,601
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TE Connectivity AMP Connectors CONN SOCKET PGA 168POS GOLD - Obsolete Bulk - Through Hole Solder Open Frame PGA Thermoplastic, Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 168 (17 x 17) Beryllium Copper 30.0µin (0.76µm) Brass
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2,750
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TE Connectivity AMP Connectors CONN SOCKET TRANSIST TO-5 10POS - Obsolete Bulk -55°C ~ 125°C Through Hole Solder Closed Frame Transistor, TO-5 Polyamide (PA), Nylon - Gold - 10 (Round) Beryllium Copper - Brass
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3,492
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Aries Electronics CONN IC DIP SOCKET 28POS GOLD - Active Bulk - Through Hole Solder Spacer DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 28 (2 x 14) Brass 200.0µin (5.08µm) Brass
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2,738
In-stock
Aries Electronics CONN IC DIP SOCKET 48POS GOLD - Active Bulk - Through Hole Solder Spacer DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 48 (2 x 24) Brass 200.0µin (5.08µm) Brass
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1,359
In-stock
Aries Electronics CONN IC DIP SOCKET 32POS GOLD - Active Bulk - Through Hole Solder Spacer DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 32 (2 x 16) Brass 200.0µin (5.08µm) Brass
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1,282
In-stock
Aries Electronics CONN IC DIP SOCKET 24POS GOLD - Active Bulk - Through Hole Solder Spacer DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 24 (2 x 12) Brass 200.0µin (5.08µm) Brass
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720
In-stock
Aries Electronics CONN IC DIP SOCKET 24POS GOLD - Active Bulk - Through Hole Solder Spacer DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 24 (2 x 12) Brass 200.0µin (5.08µm) Brass
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1,850
In-stock
Aries Electronics CONN IC DIP SOCKET 28POS GOLD - Active Bulk - Through Hole Solder Spacer DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 28 (2 x 14) Brass 200.0µin (5.08µm) Brass
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1,376
In-stock
Aries Electronics CONN IC DIP SOCKET 16POS GOLD - Active Bulk - Through Hole Solder Spacer DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 16 (2 x 8) Brass 200.0µin (5.08µm) Brass
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2,398
In-stock
Aries Electronics CONN IC DIP SOCKET 14POS GOLD - Active Bulk - Through Hole Solder Spacer DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 14 (2 x 7) Brass 200.0µin (5.08µm) Brass
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2,471
In-stock
Aries Electronics CONN IC DIP SOCKET 8POS GOLD - Active Bulk - Through Hole Solder Spacer DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 8 (2 x 4) Brass 200.0µin (5.08µm) Brass
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1,769
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Aries Electronics CONN IC DIP SOCKET 8POS GOLD Correct-A-Chip® 1109800 Active Bulk - Through Hole Solder Programmable DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 8 (2 x 4) Beryllium Copper 200.0µin (5.08µm) Brass
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986
In-stock
Aries Electronics CONN IC DIP SOCKET 26POS GOLD Correct-A-Chip® 1109800 Active Bulk - Through Hole Solder Programmable DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 26 (2 x 13) Beryllium Copper 200.0µin (5.08µm) Brass
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2,424
In-stock
Aries Electronics CONN IC DIP SOCKET 24POS GOLD Correct-A-Chip® 1109800 Active Bulk - Through Hole Solder Programmable DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 24 (2 x 12) Beryllium Copper 200.0µin (5.08µm) Brass
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1,963
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Aries Electronics CONN IC DIP SOCKET 22POS GOLD Correct-A-Chip® 1109800 Active Bulk - Through Hole Solder Programmable DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 22 (2 x 11) Beryllium Copper 200.0µin (5.08µm) Brass
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1,346
In-stock
Aries Electronics CONN IC DIP SOCKET 12POS GOLD Correct-A-Chip® 1109800 Active Bulk - Through Hole Solder Programmable DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 12 (2 x 6) Beryllium Copper 200.0µin (5.08µm) Brass
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1,785
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Aries Electronics CONN IC DIP SOCKET 10POS GOLD Correct-A-Chip® 1109800 Active Bulk - Through Hole Solder Programmable DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 10 (2 x 5) Beryllium Copper 200.0µin (5.08µm) Brass
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2,472
In-stock
Aries Electronics CONN IC DIP SOCKET 28POS GOLD Correct-A-Chip® 1109800 Active Bulk - Through Hole Solder Programmable DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 28 (2 x 14) Beryllium Copper 200.0µin (5.08µm) Brass
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747
In-stock
Aries Electronics CONN IC DIP SOCKET 20POS GOLD Correct-A-Chip® 1109800 Active Bulk - Through Hole Solder Programmable DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 20 (2 x 10) Beryllium Copper 200.0µin (5.08µm) Brass
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3,046
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Aries Electronics CONN IC DIP SOCKET 18POS GOLD Correct-A-Chip® 1109800 Active Bulk - Through Hole Solder Programmable DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 18 (2 x 9) Beryllium Copper 200.0µin (5.08µm) Brass
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2,782
In-stock
Aries Electronics CONN IC DIP SOCKET 16POS GOLD Correct-A-Chip® 1109800 Active Bulk - Through Hole Solder Programmable DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 16 (2 x 8) Beryllium Copper 200.0µin (5.08µm) Brass
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703
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Aries Electronics CONN IC DIP SOCKET 14POS GOLD Correct-A-Chip® 1109800 Active Bulk - Through Hole Solder Programmable DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 14 (2 x 7) Beryllium Copper 200.0µin (5.08µm) Brass
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2,844
In-stock
Aries Electronics CONN IC DIP SOCKET 16POS GOLD Vertisockets™ 800 Active Bulk -55°C ~ 105°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 16 (2 x 8) Beryllium Copper 200.0µin (5.08µm) Brass
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1,847
In-stock
Aries Electronics CONN IC DIP SOCKET 20POS GOLD - Active Bulk - Through Hole Solder Spacer DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 20 (2 x 10) Brass 200.0µin (5.08µm) Brass
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2,335
In-stock
Aries Electronics CONN IC DIP SOCKET 28POS GOLD - Active Bulk - Through Hole Solder Spacer DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 28 (2 x 14) Brass 200.0µin (5.08µm) Brass
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1,845
In-stock
TE Connectivity AMP Connectors CONN SOCKET SIP 16POS GOLD - Active Bulk - Through Hole Solder Closed Frame SIP Thermoplastic 0.100" (2.54mm) Gold 10.0µin (0.25µm) 16 (1 x 16) Beryllium Copper 10.0µin (0.25µm) Brass
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3,537
In-stock
TE Connectivity AMP Connectors CONN SOCKET SIP 10POS GOLD - Active Bulk - Through Hole Solder Closed Frame SIP Thermoplastic 0.100" (2.54mm) Gold 10.0µin (0.25µm) 10 (1 x 10) Beryllium Copper - Brass
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881
In-stock
TE Connectivity AMP Connectors CONN SOCKET SIP 7POS GOLD - Active Bulk - Through Hole Solder Closed Frame SIP Thermoplastic 0.100" (2.54mm) Gold 10.0µin (0.25µm) 7 (1 x 7) Beryllium Copper 10.0µin (0.25µm) Brass
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2,495
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TE Connectivity AMP Connectors CONN SOCKET SIP 20POS TINLEAD - Active Bulk - Through Hole Solder Closed Frame SIP Thermoplastic 0.100" (2.54mm) Tin-Lead - 20 (1 x 20) Beryllium Copper - Brass