- Operating Temperature :
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20 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | ||||||||||||||||||||||||
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VIEW |
2,740
In-stock
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Aries Electronics | CONN IC DIP SOCKET 34POS GOLD | Vertisockets™ 800 | Active | Bulk | -55°C ~ 105°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 34 (2 x 17) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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VIEW |
1,533
In-stock
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Aries Electronics | CONN IC DIP SOCKET 34POS GOLD | Vertisockets™ 800 | Active | Bulk | -55°C ~ 105°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 34 (2 x 17) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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VIEW |
2,762
In-stock
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Aries Electronics | CONN IC DIP SOCKET 34POS GOLD | Vertisockets™ 800 | Active | Bulk | -55°C ~ 105°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 34 (2 x 17) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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VIEW |
1,078
In-stock
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Aries Electronics | CONN IC DIP SOCKET 34POS GOLD | 508 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 34 (2 x 17) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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VIEW |
3,084
In-stock
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Aries Electronics | CONN IC DIP SOCKET 34POS GOLD | 508 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 34 (2 x 17) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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VIEW |
2,892
In-stock
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Aries Electronics | CONN IC DIP SOCKET 34POS GOLD | 508 | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 34 (2 x 17) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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VIEW |
2,716
In-stock
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Aries Electronics | CONN IC DIP SOCKET 34POS GOLD | Lo-PRO®file, 513 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 34 (2 x 17) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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VIEW |
2,597
In-stock
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Aries Electronics | CONN IC DIP SOCKET 34POS GOLD | 518 | Active | Bulk | - | Through Hole | Solder | Open Frame | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 34 (2 x 17) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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VIEW |
1,232
In-stock
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Aries Electronics | CONN IC DIP SOCKET 34POS GOLD | Lo-PRO®file, 513 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 34 (2 x 17) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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VIEW |
1,748
In-stock
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Aries Electronics | CONN IC DIP SOCKET 34POS GOLD | 518 | Active | Bulk | - | Through Hole | Solder | Open Frame | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 34 (2 x 17) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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VIEW |
3,565
In-stock
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Aries Electronics | CONN IC DIP SOCKET 34POS GOLD | Lo-PRO®file, 513 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 34 (2 x 17) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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VIEW |
2,945
In-stock
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Aries Electronics | CONN IC DIP SOCKET 34POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 34 (2 x 17) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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VIEW |
3,121
In-stock
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Aries Electronics | CONN IC DIP SOCKET 34POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 34 (2 x 17) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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VIEW |
3,997
In-stock
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Aries Electronics | CONN IC DIP SOCKET 34POS GOLD | 518 | Active | Bulk | - | Through Hole | Solder | Open Frame | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 34 (2 x 17) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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VIEW |
2,321
In-stock
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Aries Electronics | CONN IC DIP SOCKET 34POS GOLD | Lo-PRO®file, 513 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 34 (2 x 17) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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VIEW |
3,624
In-stock
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Aries Electronics | CONN IC DIP SOCKET 34POS GOLD | 518 | Active | Bulk | - | Through Hole | Solder | Open Frame | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 34 (2 x 17) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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VIEW |
2,843
In-stock
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Aries Electronics | CONN IC DIP SOCKET 34POS GOLD | Lo-PRO®file, 513 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 34 (2 x 17) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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VIEW |
671
In-stock
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Aries Electronics | CONN IC DIP SOCKET 34POS GOLD | 518 | Active | Bulk | - | Through Hole | Solder | Open Frame | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 34 (2 x 17) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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VIEW |
2,276
In-stock
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Aries Electronics | CONN IC DIP SOCKET 34POS GOLD | 508 | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 34 (2 x 17) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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|
VIEW |
823
In-stock
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Aries Electronics | CONN IC DIP SOCKET 34POS GOLD | 518 | Active | Bulk | - | Through Hole | Solder | Open Frame | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 34 (2 x 17) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
