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66 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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VIEW |
3,370
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 4POS GOLD | - | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic, Polyester | 0.100" (2.54mm) | Gold | Flash | - | 4 (2 x 2) | Beryllium Copper | - | Brass | |||
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VIEW |
3,950
In-stock
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TE Connectivity AMP Connectors | CONN IC DIP SOCKET 4POS GOLD | - | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic, Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 4 (2 x 2) | Beryllium Copper | 30.0µin (0.76µm) | Brass | |||
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VIEW |
3,653
In-stock
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TE Connectivity AMP Connectors | CONN IC DIP SOCKET 4POS GOLD | - | Obsolete | Tape & Reel (TR) | -55°C ~ 125°C | Surface Mount | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic, Polyester | 0.100" (2.54mm) | Gold | 5.00µin (0.127µm) | Gold | 4 (2 x 2) | Beryllium Copper | 5.00µin (0.127µm) | Brass | |||
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VIEW |
3,352
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 4POS GOLD | 508 | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 4 (2 x 2) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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VIEW |
1,085
In-stock
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Aries Electronics | CONN IC DIP SOCKET 4POS GOLD | 508 | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 4 (2 x 2) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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VIEW |
3,929
In-stock
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Aries Electronics | CONN IC DIP SOCKET 4POS GOLD | Lo-PRO®file, 513 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 4 (2 x 2) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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VIEW |
1,881
In-stock
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Aries Electronics | CONN IC DIP SOCKET 4POS GOLD | 518 | Active | Bulk | - | Through Hole | Solder | Open Frame | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 4 (2 x 2) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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VIEW |
1,593
In-stock
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Aries Electronics | CONN IC DIP SOCKET 4POS GOLD | 518 | Active | Bulk | - | Through Hole | Solder | Open Frame | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 4 (2 x 2) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
VIEW |
3,182
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 4POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 4 (2 x 2) | Beryllium Copper | - | Brass | |||
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VIEW |
891
In-stock
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Aries Electronics | CONN IC DIP SOCKET 4POS GOLD | 518 | Active | Bulk | - | Through Hole | Solder | Open Frame | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 4 (2 x 2) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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VIEW |
2,048
In-stock
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Aries Electronics | CONN IC DIP SOCKET 4POS GOLD | 518 | Active | Bulk | - | Through Hole | Solder | Open Frame | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 4 (2 x 2) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
VIEW |
3,450
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 4POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 4 (2 x 2) | Beryllium Copper | - | Brass | |||
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VIEW |
3,602
In-stock
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Preci-Dip | CONN IC DIP SOCKET 4POS GOLD | 124 | Active | Tube | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 4 (2 x 2) | Beryllium Copper | - | Brass | |||
|
VIEW |
792
In-stock
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Preci-Dip | CONN IC DIP SOCKET 4POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | Flash | Tin | 4 (2 x 2) | Beryllium Copper | - | Brass | |||
|
VIEW |
3,121
In-stock
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Preci-Dip | CONN IC DIP SOCKET 4POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 4 (2 x 2) | Beryllium Copper | - | Brass | |||
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VIEW |
1,427
In-stock
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Aries Electronics | CONN IC DIP SOCKET 4POS GOLD | 518 | Active | Bulk | - | Through Hole | Solder | Open Frame | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 4 (2 x 2) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
VIEW |
1,642
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 4POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 4 (2 x 2) | Beryllium Copper | - | Brass | |||
|
VIEW |
3,962
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 4POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | Flash | Tin | 4 (2 x 2) | Beryllium Copper | - | Brass | |||
|
VIEW |
2,993
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 4POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 4 (2 x 2) | Beryllium Copper | - | Brass | |||
|
VIEW |
2,660
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 4POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 4 (2 x 2) | Beryllium Copper | - | Brass | |||
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|
VIEW |
3,528
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 4POS GOLD | 146 | Active | Tube | -55°C ~ 125°C | Through Hole | Press-Fit | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 4 (2 x 2) | Beryllium Copper | - | Brass | |||
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|
VIEW |
1,498
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 4POS GOLD | 146 | Active | Tube | -55°C ~ 125°C | Through Hole | Press-Fit | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 4 (2 x 2) | Beryllium Copper | - | Brass | |||
|
VIEW |
2,490
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 4POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 4 (2 x 2) | Beryllium Copper | - | Brass | |||
|
VIEW |
2,157
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 4POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | Flash | Tin | 4 (2 x 2) | Beryllium Copper | - | Brass | |||
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|
VIEW |
3,268
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 4POS GOLD | 508 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 4 (2 x 2) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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|
VIEW |
3,922
In-stock
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Aries Electronics | CONN IC DIP SOCKET 4POS GOLD | 508 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 4 (2 x 2) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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VIEW |
676
In-stock
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Aries Electronics | CONN IC DIP SOCKET 4POS GOLD | Vertisockets™ 800 | Active | Bulk | -55°C ~ 105°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 4 (2 x 2) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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|
VIEW |
2,364
In-stock
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Aries Electronics | CONN IC DIP SOCKET 4POS GOLD | Vertisockets™ 800 | Active | Bulk | -55°C ~ 105°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 4 (2 x 2) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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|
VIEW |
3,368
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 4POS GOLD | Vertisockets™ 800 | Active | Bulk | -55°C ~ 105°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 4 (2 x 2) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
VIEW |
1,574
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 4POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 4 (2 x 2) | Beryllium Copper | - | Brass | |||
