- Applied Filters :
-
- Sockets for ICs, Transistors
- Contact Material - Post : Brass
- Number of Positions or Pins (Grid) : 20 (2 x 10)
- Contact Finish - Mating : Gold
- Part Status : Active
- Contact Finish Thickness - Mating : 30.0µin (0.76µm)
- Housing Material : Polyamide (PA46), Nylon 4/6, Glass Filled
- Features : Closed Frame, Elevated
39 results
Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
GLOBAL STOCKS | |||||||||||||||||||||||
VIEW |
1,288
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 20POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 20 (2 x 10) | Beryllium Copper | 10.0µin (0.25µm) | Brass | ||||
VIEW |
1,288
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 20POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 20 (2 x 10) | Beryllium Copper | 10.0µin (0.25µm) | Brass | ||||
VIEW |
3,088
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 20POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 20 (2 x 10) | Beryllium Copper | 10.0µin (0.25µm) | Brass | ||||
VIEW |
3,701
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 20POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 20 (2 x 10) | Beryllium Copper | 10.0µin (0.25µm) | Brass | ||||
VIEW |
1,320
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 20POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 20 (2 x 10) | Beryllium Copper | 10.0µin (0.25µm) | Brass | ||||
VIEW |
1,069
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 20POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 20 (2 x 10) | Beryllium Copper | 10.0µin (0.25µm) | Brass | ||||
VIEW |
2,712
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 20POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 20 (2 x 10) | Beryllium Copper | 10.0µin (0.25µm) | Brass | ||||
VIEW |
604
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 20POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 20 (2 x 10) | Beryllium Copper | 10.0µin (0.25µm) | Brass | ||||
VIEW |
3,515
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 20POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 20 (2 x 10) | Beryllium Copper | 10.0µin (0.25µm) | Brass | ||||
VIEW |
1,888
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 20POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 20 (2 x 10) | Beryllium Copper | 10.0µin (0.25µm) | Brass | ||||
VIEW |
3,136
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 20POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 20 (2 x 10) | Beryllium Copper | 10.0µin (0.25µm) | Brass | ||||
VIEW |
3,393
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 20POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 20 (2 x 10) | Beryllium Copper | 10.0µin (0.25µm) | Brass | ||||
VIEW |
1,821
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 20POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 20 (2 x 10) | Beryllium Copper | 10.0µin (0.25µm) | Brass | ||||
VIEW |
3,471
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 20POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 20 (2 x 10) | Beryllium Copper | 10.0µin (0.25µm) | Brass | ||||
VIEW |
2,713
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 20POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 20 (2 x 10) | Beryllium Copper | 10.0µin (0.25µm) | Brass | ||||
VIEW |
2,615
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 20POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 20 (2 x 10) | Beryllium Copper | 10.0µin (0.25µm) | Brass | ||||
VIEW |
3,719
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 20POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 20 (2 x 10) | Beryllium Copper | 10.0µin (0.25µm) | Brass | ||||
VIEW |
3,114
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 20POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 20 (2 x 10) | Beryllium Copper | 10.0µin (0.25µm) | Brass | ||||
VIEW |
2,516
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 20POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 20 (2 x 10) | Beryllium Copper | 10.0µin (0.25µm) | Brass | ||||
VIEW |
2,893
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 20POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 20 (2 x 10) | Beryllium Copper | 10.0µin (0.25µm) | Brass | ||||
VIEW |
1,599
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 20POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 20 (2 x 10) | Beryllium Copper | 10.0µin (0.25µm) | Brass | ||||
VIEW |
3,995
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 20POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 20 (2 x 10) | Beryllium Copper | 10.0µin (0.25µm) | Brass | ||||
VIEW |
3,184
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 20POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 20 (2 x 10) | Beryllium Copper | 10.0µin (0.25µm) | Brass | ||||
VIEW |
1,176
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 20POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 20 (2 x 10) | Beryllium Copper | 10.0µin (0.25µm) | Brass | ||||
VIEW |
2,378
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 20POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 20 (2 x 10) | Beryllium Copper | 10.0µin (0.25µm) | Brass | ||||
VIEW |
1,024
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 20POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 20 (2 x 10) | Beryllium Copper | 10.0µin (0.25µm) | Brass | ||||
VIEW |
1,163
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 20POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 20 (2 x 10) | Beryllium Copper | 10.0µin (0.25µm) | Brass | ||||
VIEW |
2,117
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 20POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 20 (2 x 10) | Beryllium Copper | 10.0µin (0.25µm) | Brass | ||||
VIEW |
3,916
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 20POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 20 (2 x 10) | Beryllium Copper | 10.0µin (0.25µm) | Brass | ||||
VIEW |
983
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 20POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 20 (2 x 10) | Beryllium Copper | 10.0µin (0.25µm) | Brass |