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13 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Material - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | ||||||||||||||||||||||
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VIEW |
2,009
In-stock
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Aries Electronics | CONN IC DIP SOCKET 16POS GOLD | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 16 (2 x 8) | Beryllium Copper | Brass | |||
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VIEW |
3,704
In-stock
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Aries Electronics | CONN IC DIP SOCKET 16POS GOLD | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 16 (2 x 8) | Beryllium Copper | Brass | |||
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|
VIEW |
3,219
In-stock
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Aries Electronics | CONN IC DIP SOCKET 16POS GOLD | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 16 (2 x 8) | Beryllium Copper | Brass | |||
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|
VIEW |
1,252
In-stock
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Aries Electronics | CONN IC DIP SOCKET 16POS GOLD | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 16 (2 x 8) | Beryllium Copper | Brass | |||
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|
VIEW |
797
In-stock
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Aries Electronics | CONN IC DIP SOCKET 14POS GOLD | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 125°C | Surface Mount | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 14 (2 x 7) | Beryllium Copper | Brass | |||
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|
VIEW |
3,240
In-stock
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Aries Electronics | CONN IC DIP SOCKET 14POS GOLD | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 125°C | Surface Mount | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 14 (2 x 7) | Beryllium Copper | Brass | |||
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|
VIEW |
2,752
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 14POS GOLD | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 14 (2 x 7) | Beryllium Copper | Brass | |||
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|
VIEW |
2,584
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 14POS GOLD | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 14 (2 x 7) | Beryllium Copper | Brass | |||
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|
VIEW |
1,334
In-stock
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Aries Electronics | CONN IC DIP SOCKET 16POS GOLD | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 16 (2 x 8) | Beryllium Copper | Brass | |||
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|
VIEW |
3,274
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 14POS GOLD | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 14 (2 x 7) | Beryllium Copper | Brass | |||
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|
VIEW |
3,088
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 14POS GOLD | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 14 (2 x 7) | Beryllium Copper | Brass | |||
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|
VIEW |
1,713
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 16POS GOLD | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 16 (2 x 8) | Beryllium Copper | Brass | |||
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|
VIEW |
859
In-stock
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Aries Electronics | CONN IC DIP SOCKET 16POS GOLD | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 16 (2 x 8) | Beryllium Copper | Brass | |||
