- Part Status :
- Packaging :
- Operating Temperature :
- Mounting Type :
- Termination :
- Number of Positions or Pins (Grid) :
-
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- 2 (1 x 2) (8)
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- 24 (2 x 12) (39)
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- 26 (1 x 26) (4)
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- 40 (1 x 40) (5)
- 40 (2 x 20) (17)
- 42 (2 x 21) (1)
- 44 (2 x 22) (2)
- 48 (2 x 24) (7)
- 5 (1 x 5) (4)
- 50 (2 x 25) (5)
- 58 (2 x 29) (1)
- 6 (1 x 6) (4)
- 6 (2 x 3) (12)
- 60 (2 x 30) (1)
- 64 (2 x 32) (6)
- 7 (1 x 7) (4)
- 8 (1 x 8) (4)
- 8 (2 x 4) (17)
- 9 (1 x 9) (4)
- Contact Finish Thickness - Post :
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445 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | ||||||||||||||||||||||||
|
VIEW |
1,044
In-stock
|
Harwin Inc. | CONN IC DIP SOCKET 24POS GOLD | D0 | Obsolete | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 24 (2 x 12) | Beryllium Copper | 196.9µin (5.00µm) | Brass | |||
|
|
VIEW |
3,236
In-stock
|
Harwin Inc. | CONN IC DIP SOCKET 22POS GOLD | D0 | Obsolete | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.4" (10.16mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 22 (2 x 11) | Beryllium Copper | 196.9µin (5.00µm) | Brass | |||
|
|
VIEW |
876
In-stock
|
Harwin Inc. | CONN IC DIP SOCKET 20POS GOLD | D0 | Obsolete | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 20 (2 x 10) | Beryllium Copper | 196.9µin (5.00µm) | Brass | |||
|
|
VIEW |
2,860
In-stock
|
Harwin Inc. | CONN IC DIP SOCKET 18POS GOLD | D0 | Obsolete | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 18 (2 x 9) | Beryllium Copper | 196.9µin (5.00µm) | Brass | |||
|
|
VIEW |
1,176
In-stock
|
Harwin Inc. | CONN IC DIP SOCKET 16POS GOLD | D0 | Obsolete | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 16 (2 x 8) | Beryllium Copper | 196.9µin (5.00µm) | Brass | |||
|
|
VIEW |
2,187
In-stock
|
Harwin Inc. | CONN IC DIP SOCKET 14POS GOLD | D0 | Obsolete | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 14 (2 x 7) | Beryllium Copper | 196.9µin (5.00µm) | Brass | |||
|
|
VIEW |
3,435
In-stock
|
Harwin Inc. | CONN IC DIP SOCKET 8POS GOLD | D0 | Obsolete | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 8 (2 x 4) | Beryllium Copper | 196.9µin (5.00µm) | Brass | |||
|
|
VIEW |
3,550
In-stock
|
Harwin Inc. | CONN IC DIP SOCKET 6POS GOLD | D0 | Obsolete | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 6 (2 x 3) | Beryllium Copper | 196.9µin (5.00µm) | Brass | |||
|
|
VIEW |
3,452
In-stock
|
Harwin Inc. | CONN IC DIP SOCKET 24POS GOLD | D0 | Obsolete | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.4" (10.16mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 24 (2 x 12) | Beryllium Copper | 196.9µin (5.00µm) | Brass | |||
|
|
VIEW |
1,249
In-stock
|
Amphenol FCI | CONN IC DIP SOCKET 24POS GOLD | - | Obsolete | Tube | - | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 24 (2 x 12) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
1,075
In-stock
|
Amphenol FCI | CONN IC DIP SOCKET 16POS GOLD | - | Obsolete | Tube | - | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 16 (2 x 8) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
2,772
In-stock
|
Amphenol FCI | CONN IC DIP SOCKET 18POS GOLD | - | Obsolete | Tube | - | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 18 (2 x 9) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
3,228
In-stock
|
Amphenol FCI | CONN IC DIP SOCKET 28POS GOLD | - | Obsolete | Tube | - | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 28 (2 x 14) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
915
In-stock
|
Amphenol FCI | CONN IC DIP SOCKET 24POS GOLD | - | Obsolete | Tube | - | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 24 (2 x 12) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
2,500
In-stock
|
Amphenol FCI | CONN IC DIP SOCKET 40POS GOLD | - | Obsolete | Tube | - | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 40 (2 x 20) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
3,818
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 60POS GOLD | 518 | Obsolete | Bulk | - | Through Hole | Solder | Open Frame | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 60 (2 x 30) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
901
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 50POS GOLD | 518 | Active | Bulk | - | Through Hole | Solder | Open Frame | DIP, 0.9" (22.86mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 50 (2 x 25) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
2,974
In-stock
|
Aries Electronics | CONN SOCKET SIP 2POS GOLD | 518 | Active | Bulk | - | Surface Mount | Solder | Open Frame | SIP | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 2 (1 x 2) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
2,794
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 64POS GOLD | 518 | Active | Bulk | - | Through Hole | Solder | Open Frame | DIP, 0.9" (22.86mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 64 (2 x 32) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
2,932
In-stock
|
Aries Electronics | CONN SOCKET SIP 40POS GOLD | 518 | Active | Bulk | - | Through Hole | Solder | Open Frame | SIP | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 40 (1 x 40) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
3,970
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 28POS GOLD | 518 | Active | Bulk | - | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 28 (2 x 14) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
2,472
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 48POS GOLD | 518 | Active | Bulk | - | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 48 (2 x 24) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
1,703
In-stock
|
Samtec Inc. | DIP SOCKETS | ICA | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 32 (2 x 16) | Beryllium Copper | - | Brass | |||
|
|
VIEW |
1,799
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 18POS GOLD | 518 | Active | Bulk | - | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 18 (2 x 9) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
VIEW |
2,817
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 64POS GOLD | 518 | Active | Bulk | - | Through Hole | Solder | Open Frame | DIP, 0.9" (22.86mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 64 (2 x 32) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
2,597
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 34POS GOLD | 518 | Active | Bulk | - | Through Hole | Solder | Open Frame | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 34 (2 x 17) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
3,460
In-stock
|
Aries Electronics | CONN SOCKET SIP 34POS GOLD | 518 | Active | Bulk | - | Surface Mount | Solder | Open Frame | SIP | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 34 (1 x 34) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
3,342
In-stock
|
Aries Electronics | CONN SOCKET SIP 33POS GOLD | 518 | Active | Bulk | - | Surface Mount | Solder | Open Frame | SIP | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 33 (1 x 33) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
3,121
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 64POS GOLD | 518 | Active | Bulk | - | Through Hole | Solder | Open Frame | DIP, 0.9" (22.86mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 64 (2 x 32) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
1,559
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 14POS GOLD | 518 | Active | Bulk | - | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 14 (2 x 7) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
