Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
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1,362
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Harwin Inc. CONN SOCKET SIP 9POS GOLD D01-950 Obsolete Bulk -55°C ~ 125°C Through Hole Solder Elevated SIP Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 9 (1 x 9) Beryllium Copper - Brass
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1,549
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Amphenol FCI CONN SOCKET SIP 9POS GOLD SIP050-1x Obsolete Bulk - Through Hole Solder Closed Frame SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 9 (1 x 9) Beryllium Copper 200.0µin (5.08µm) Brass
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2,486
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Amphenol FCI CONN SOCKET SIP 9POS TIN SIP050-1x Obsolete Bulk - Through Hole Solder Closed Frame SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 9 (1 x 9) Beryllium Copper 200.0µin (5.08µm) Brass
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1,016
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Amphenol FCI CONN SOCKET SIP 9POS GOLD SIP1x Obsolete Bulk - Through Hole Solder Closed Frame SIP Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 9 (1 x 9) Beryllium Copper 200.0µin (5.08µm) Brass
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2,947
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Aries Electronics CONN SOCKET SIP 9POS GOLD 508 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 9 (1 x 9) Beryllium Copper 10.0µin (0.25µm) Brass
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630
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Aries Electronics CONN SOCKET SIP 9POS GOLD 508 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 9 (1 x 9) Beryllium Copper 10.0µin (0.25µm) Brass
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3,955
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Harwin Inc. CONN SOCKET SIP 9POS GOLD D01-997 Active Bulk -55°C ~ 125°C Through Hole Solder - SIP Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold Flash Tin 9 (1 x 9) Beryllium Copper 196.9µin (5.00µm) Brass
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2,349
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Aries Electronics CONN SOCKET SIP 9POS GOLD 508 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 9 (1 x 9) Beryllium Copper 200.0µin (5.08µm) Brass
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1,581
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Aries Electronics CONN SOCKET SIP 9POS GOLD 508 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 9 (1 x 9) Beryllium Copper 200.0µin (5.08µm) Brass
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3,482
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Aries Electronics CONN SOCKET SIP 9POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 9 (1 x 9) Beryllium Copper 200.0µin (5.08µm) Brass
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3,932
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Aries Electronics CONN SOCKET SIP 9POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 9 (1 x 9) Beryllium Copper 200.0µin (5.08µm) Brass
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1,206
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Aries Electronics CONN SOCKET SIP 9POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 9 (1 x 9) Beryllium Copper 10.0µin (0.25µm) Brass
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2,684
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Aries Electronics CONN SOCKET SIP 9POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 9 (1 x 9) Beryllium Copper 10.0µin (0.25µm) Brass
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2,148
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Aries Electronics CONN SOCKET SIP 9POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 9 (1 x 9) Beryllium Copper 200.0µin (5.08µm) Brass
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2,819
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Aries Electronics CONN SOCKET SIP 9POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 9 (1 x 9) Beryllium Copper 200.0µin (5.08µm) Brass
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2,773
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Aries Electronics CONN SOCKET SIP 9POS GOLD 0503 Active Bulk - Through Hole Wire Wrap - SIP Polyamide (PA), Nylon, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 9 (1 x 9) Beryllium Copper 10.0µin (0.25µm) Brass
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1,535
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Aries Electronics CONN SOCKET SIP 9POS GOLD 0503 Active Bulk - Through Hole Wire Wrap - SIP Polyamide (PA), Nylon, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 9 (1 x 9) Beryllium Copper 10.0µin (0.25µm) Brass
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708
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Aries Electronics CONN SOCKET SIP 9POS GOLD 0503 Active Bulk - Through Hole Wire Wrap - SIP Polyamide (PA), Nylon, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 9 (1 x 9) Beryllium Copper 200.0µin (5.08µm) Brass
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2,230
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Aries Electronics CONN SOCKET SIP 9POS GOLD 0503 Active Bulk - Through Hole Wire Wrap - SIP Polyamide (PA), Nylon, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 9 (1 x 9) Beryllium Copper 200.0µin (5.08µm) Brass
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1,092
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Aries Electronics CONN SOCKET SIP 9POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 9 (1 x 9) Beryllium Copper 10.0µin (0.25µm) Brass
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1,724
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Aries Electronics CONN SOCKET SIP 9POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 9 (1 x 9) Beryllium Copper 10.0µin (0.25µm) Brass
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3,659
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Harwin Inc. CONN SOCKET SIP 9POS GOLD D01-995 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap - SIP Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 9 (1 x 9) Beryllium Copper 196.9µin (5.00µm) Brass
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1,272
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Aries Electronics CONN SOCKET SIP 9POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 9 (1 x 9) Beryllium Copper 200.0µin (5.08µm) Brass
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3,471
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Aries Electronics CONN SOCKET SIP 9POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 9 (1 x 9) Beryllium Copper 200.0µin (5.08µm) Brass