- Part Status :
- Operating Temperature :
- Contact Finish Thickness - Mating :
- Contact Finish - Post :
- Number of Positions or Pins (Grid) :
-
- 10 (2 x 5) (22)
- 12 (2 x 6) (8)
- 14 (2 x 7) (14)
- 16 (2 x 8) (14)
- 18 (2 x 9) (30)
- 2 (1 x 2) (1)
- 20 (2 x 10) (11)
- 22 (2 x 11) (6)
- 24 (2 x 12) (57)
- 26 (2 x 13) (2)
- 28 (2 x 14) (66)
- 30 (2 x 15) (8)
- 32 (2 x 16) (52)
- 34 (2 x 17) (2)
- 36 (2 x 18) (16)
- 38 (2 x 19) (2)
- 40 (2 x 20) (62)
- 42 (2 x 21) (11)
- 44 (2 x 22) (2)
- 48 (2 x 24) (26)
- 50 (2 x 25) (6)
- 52 (2 x 26) (6)
- 6 (2 x 3) (5)
- 8 (2 x 4) (13)
- Applied Filters :
442 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | ||||||||||||||||||||||||
|
VIEW |
1,816
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 40POS TINLEAD | 500 | Obsolete | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | - | 0.100" (2.54mm) | Tin-Lead | - | - | 40 (2 x 20) | Beryllium Copper | - | Brass | |||
|
|
VIEW |
1,639
In-stock
|
3M | CONN IC DIP SOCKET 48POS GOLD | 100 | Obsolete | Bulk | -65°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | Gold | 48 (2 x 24) | Beryllium Copper | Flash | Brass | |||
|
|
VIEW |
2,207
In-stock
|
3M | CONN IC DIP SOCKET 42POS GOLD | 100 | Obsolete | Bulk | -65°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | Gold | 42 (2 x 21) | Beryllium Copper | Flash | Brass | |||
|
|
VIEW |
2,933
In-stock
|
3M | CONN IC DIP SOCKET 40POS GOLD | 100 | Obsolete | Bulk | -65°C ~ 125°C | Through Hole | Solder | Closed Frame, Seal Tape | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | Gold | 40 (2 x 20) | Beryllium Copper | Flash | Brass | |||
|
|
VIEW |
2,994
In-stock
|
3M | CONN IC DIP SOCKET 40POS GOLD | 100 | Obsolete | Bulk | -65°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | Gold | 40 (2 x 20) | Beryllium Copper | Flash | Brass | |||
|
|
VIEW |
2,183
In-stock
|
3M | CONN IC DIP SOCKET 32POS GOLD | 100 | Obsolete | Bulk | -65°C ~ 125°C | Through Hole | Solder | Closed Frame, Seal Tape | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | Gold | 32 (2 x 16) | Beryllium Copper | Flash | Brass | |||
|
|
VIEW |
3,440
In-stock
|
3M | CONN IC DIP SOCKET 32POS GOLD | 100 | Obsolete | Bulk | -65°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | Gold | 32 (2 x 16) | Beryllium Copper | Flash | Brass | |||
|
|
VIEW |
1,585
In-stock
|
3M | CONN IC DIP SOCKET 28POS GOLD | 100 | Obsolete | Bulk | -65°C ~ 125°C | Through Hole | Solder | Closed Frame, Seal Tape | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | Gold | 28 (2 x 14) | Beryllium Copper | Flash | Brass | |||
|
|
VIEW |
3,029
In-stock
|
3M | CONN IC DIP SOCKET 28POS GOLD | 100 | Obsolete | Bulk | -65°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | Gold | 28 (2 x 14) | Beryllium Copper | Flash | Brass | |||
|
|
VIEW |
2,054
In-stock
|
3M | CONN IC DIP SOCKET 24POS GOLD | 100 | Obsolete | Bulk | -65°C ~ 125°C | Through Hole | Solder | Closed Frame, Seal Tape | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | Gold | 24 (2 x 12) | Beryllium Copper | Flash | Brass | |||
|
|
VIEW |
1,985
In-stock
|
3M | CONN IC DIP SOCKET 24POS GOLD | 100 | Obsolete | Bulk | -65°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | Gold | 24 (2 x 12) | Beryllium Copper | Flash | Brass | |||
|
|
VIEW |
3,492
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 28POS GOLD | - | Active | Bulk | - | Through Hole | Solder | Spacer | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin-Lead | 28 (2 x 14) | Brass | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
2,738
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 48POS GOLD | - | Active | Bulk | - | Through Hole | Solder | Spacer | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin-Lead | 48 (2 x 24) | Brass | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
1,359
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 32POS GOLD | - | Active | Bulk | - | Through Hole | Solder | Spacer | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin-Lead | 32 (2 x 16) | Brass | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
1,282
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 24POS GOLD | - | Active | Bulk | - | Through Hole | Solder | Spacer | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin-Lead | 24 (2 x 12) | Brass | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
645
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 48POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 48 (2 x 24) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
2,392
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 48POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 48 (2 x 24) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
3,723
In-stock
|
3M | CONN IC DIP SOCKET 48POS GOLD | 100 | Obsolete | Bulk | -65°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | Gold | 48 (2 x 24) | Beryllium Copper | Flash | Brass | |||
|
|
VIEW |
655
In-stock
|
3M | CONN IC DIP SOCKET 42POS GOLD | 100 | Obsolete | Bulk | -65°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | Gold | 42 (2 x 21) | Beryllium Copper | Flash | Brass | |||
|
|
VIEW |
785
In-stock
|
3M | CONN IC DIP SOCKET 40POS GOLD | 100 | Obsolete | Bulk | -65°C ~ 125°C | Through Hole | Solder | Closed Frame, Seal Tape | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | Gold | 40 (2 x 20) | Beryllium Copper | Flash | Brass | |||
|
|
VIEW |
2,023
In-stock
|
3M | CONN IC DIP SOCKET 40POS GOLD | 100 | Obsolete | Bulk | -65°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | Gold | 40 (2 x 20) | Beryllium Copper | Flash | Brass | |||
|
|
VIEW |
1,777
In-stock
|
3M | CONN IC DIP SOCKET 32POS GOLD | 100 | Obsolete | Bulk | -65°C ~ 125°C | Through Hole | Solder | Closed Frame, Seal Tape | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | Gold | 32 (2 x 16) | Beryllium Copper | Flash | Brass | |||
|
|
VIEW |
2,087
In-stock
|
3M | CONN IC DIP SOCKET 32POS GOLD | 100 | Obsolete | Bulk | -65°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | Gold | 32 (2 x 16) | Beryllium Copper | Flash | Brass | |||
|
|
VIEW |
2,687
In-stock
|
3M | CONN IC DIP SOCKET 28POS GOLD | 100 | Obsolete | Bulk | -65°C ~ 125°C | Through Hole | Solder | Closed Frame, Seal Tape | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | Gold | 28 (2 x 14) | Beryllium Copper | Flash | Brass | |||
|
|
VIEW |
1,316
In-stock
|
3M | CONN IC DIP SOCKET 28POS GOLD | 100 | Obsolete | Bulk | -65°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | Gold | 28 (2 x 14) | Beryllium Copper | Flash | Brass | |||
|
|
VIEW |
1,098
In-stock
|
3M | CONN IC DIP SOCKET 24POS GOLD | 100 | Obsolete | Bulk | -65°C ~ 125°C | Through Hole | Solder | Closed Frame, Seal Tape | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | Gold | 24 (2 x 12) | Beryllium Copper | Flash | Brass | |||
|
|
VIEW |
3,503
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 32POS GOLD | 6556 | Active | Bulk | - | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 32 (2 x 16) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
3,451
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 44POS GOLD | 6556 | Active | Bulk | - | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 44 (2 x 22) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
3,168
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 48POS GOLD | 6556 | Active | Bulk | - | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 48 (2 x 24) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
3,808
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 36POS GOLD | 6556 | Active | Bulk | - | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 36 (2 x 18) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
