Number of Positions or Pins (Grid) :
Contact Finish Thickness - Post :
Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
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1,802
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Harwin Inc. CONN SOCKET SIP 32POS GOLD D01-950 Obsolete Bulk -55°C ~ 125°C Through Hole Solder Elevated SIP Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 32 (1 x 32) Beryllium Copper - Brass
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2,149
In-stock
Harwin Inc. CONN SOCKET SIP 20POS GOLD D01-950 Obsolete Bulk -55°C ~ 125°C Through Hole Solder Elevated SIP Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 20 (1 x 20) Beryllium Copper - Brass
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1,231
In-stock
Harwin Inc. CONN SOCKET SIP 18POS GOLD D01-950 Obsolete Bulk -55°C ~ 125°C Through Hole Solder Elevated SIP Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 18 (1 x 18) Beryllium Copper - Brass
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3,042
In-stock
Harwin Inc. CONN SOCKET SIP 16POS GOLD D01-950 Obsolete Bulk -55°C ~ 125°C Through Hole Solder Elevated SIP Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 16 (1 x 16) Beryllium Copper - Brass
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1,236
In-stock
Harwin Inc. CONN SOCKET SIP 14POS GOLD D01-950 Obsolete Bulk -55°C ~ 125°C Through Hole Solder Elevated SIP Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 14 (1 x 14) Beryllium Copper - Brass
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3,973
In-stock
Harwin Inc. CONN SOCKET SIP 12POS GOLD D01-950 Obsolete Bulk -55°C ~ 125°C Through Hole Solder Elevated SIP Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 12 (1 x 12) Beryllium Copper - Brass
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3,521
In-stock
Harwin Inc. CONN SOCKET SIP 10POS GOLD D01-950 Obsolete Bulk -55°C ~ 125°C Through Hole Solder Elevated SIP Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 10 (1 x 10) Beryllium Copper - Brass
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1,362
In-stock
Harwin Inc. CONN SOCKET SIP 9POS GOLD D01-950 Obsolete Bulk -55°C ~ 125°C Through Hole Solder Elevated SIP Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 9 (1 x 9) Beryllium Copper - Brass
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RFQ
3,194
In-stock
Harwin Inc. CONN SOCKET SIP 8POS GOLD D01-950 Obsolete Bulk -55°C ~ 125°C Through Hole Solder Elevated SIP Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 8 (1 x 8) Beryllium Copper - Brass
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1,684
In-stock
Harwin Inc. CONN SOCKET SIP 7POS GOLD D01-950 Obsolete Bulk -55°C ~ 125°C Through Hole Solder Elevated SIP Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 7 (1 x 7) Beryllium Copper - Brass
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RFQ
2,955
In-stock
Harwin Inc. CONN SOCKET SIP 6POS GOLD D01-950 Obsolete Bulk -55°C ~ 125°C Through Hole Solder Elevated SIP Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 6 (1 x 6) Beryllium Copper - Brass
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2,665
In-stock
Harwin Inc. CONN SOCKET SIP 5POS GOLD D01-950 Obsolete Bulk -55°C ~ 125°C Through Hole Solder Elevated SIP Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 5 (1 x 5) Beryllium Copper - Brass
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1,164
In-stock
Harwin Inc. CONN SOCKET SIP 4POS GOLD D01-950 Obsolete Bulk -55°C ~ 125°C Through Hole Solder Elevated SIP Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 4 (1 x 4) Beryllium Copper - Brass
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2,017
In-stock
Preci-Dip CONN SOCKET PGA 296POS GOLD 614 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier, Open Frame PGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 296 (19 x 19) Beryllium Copper - Brass
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2,985
In-stock
Preci-Dip CONN SOCKET PGA 325POS GOLD 614 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier, Open Frame PGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 325 (18 x 18) Beryllium Copper - Brass
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1,755
In-stock
Preci-Dip CONN SOCKET PGA 321POS GOLD 614 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier, Open Frame PGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 321 (21 x 21) Beryllium Copper - Brass
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3,544
In-stock
Preci-Dip CONN SOCKET PGA 320POS GOLD 614 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier, Open Frame PGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 320 (19 x 19) Beryllium Copper - Brass
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1,612
In-stock
Preci-Dip CONN SOCKET PGA 179POS GOLD 614 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier, Open Frame PGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 179 (15 x 15) Beryllium Copper - Brass
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RFQ
2,904
In-stock
Preci-Dip CONN SOCKET PGA 361POS GOLD 510 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame PGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 361 (19 x 19) Beryllium Copper - Brass
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RFQ
1,632
In-stock
Preci-Dip CONN SOCKET PGA 168POS GOLD 614 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier, Open Frame PGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 168 (17 x 17) Beryllium Copper - Brass
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1,721
In-stock
Preci-Dip CONN SOCKET PGA 175POS GOLD 614 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier, Open Frame PGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 175 (16 x 16) Beryllium Copper - Brass
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RFQ
2,754
In-stock
Preci-Dip CONN SOCKET PGA 299POS GOLD 614 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier, Open Frame PGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 299 (20 x 20) Beryllium Copper - Brass
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1,850
In-stock
Preci-Dip CONN SOCKET PGA 289POS GOLD 510 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame PGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 289 (17 x 17) Beryllium Copper - Brass
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RFQ
2,493
In-stock
Preci-Dip CONN SOCKET PGA 225POS GOLD 614 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier, Open Frame PGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 225 (17 x 17) Beryllium Copper - Brass
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1,659
In-stock
Preci-Dip CONN SOCKET PGA 132POS GOLD 614 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier, Open Frame PGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 132 (13 x 13) Beryllium Copper - Brass
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RFQ
947
In-stock
Preci-Dip CONN SOCKET PGA 132POS GOLD 614 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier, Open Frame PGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 132 (14 x 14) Beryllium Copper - Brass
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3,421
In-stock
Preci-Dip CONN SOCKET PGA 281POS GOLD 510 Active Bulk -55°C ~ 125°C Through Hole Solder Open Frame PGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 281 (19 x 19) Beryllium Copper - Brass
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RFQ
1,931
In-stock
Preci-Dip CONN SOCKET PGA 144POS GOLD 614 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier, Open Frame PGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 144 (15 x 15) Beryllium Copper - Brass
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RFQ
1,875
In-stock
Preci-Dip CONN SOCKET PGA 280POS GOLD 510 Active Bulk -55°C ~ 125°C Through Hole Solder Open Frame PGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 280 (19 x 19) Beryllium Copper - Brass
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1,550
In-stock
Preci-Dip CONN SOCKET PGA 273POS GOLD 510 Active Bulk -55°C ~ 125°C Through Hole Solder Open Frame PGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 273 (21 x 21) Beryllium Copper - Brass