Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
GLOBAL STOCKS
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2,988
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Samtec Inc. CONN IC DIP SOCKET 28POS GOLD ICO Active Bulk -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyester, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 28 (2 x 14) Beryllium Copper - Brass
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860
In-stock
Samtec Inc. CONN IC DIP SOCKET 40POS GOLD ICO Active Bulk -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyester, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 40 (2 x 20) Beryllium Copper - Brass
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847
In-stock
Samtec Inc. CONN IC DIP SOCKET 14POS GOLD ICA Active Bulk -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyester, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 14 (2 x 7) Beryllium Copper 30.0µin (0.76µm) Brass
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3,377
In-stock
Samtec Inc. CONN IC DIP SOCKET 18POS GOLD ICA Active Bulk -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyester, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 18 (2 x 9) Beryllium Copper 10.0µin (0.25µm) Brass
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2,774
In-stock
Samtec Inc. CONN IC DIP SOCKET 20POS GOLD ICO Active Bulk -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyester, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 20 (2 x 10) Beryllium Copper - Brass
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2,571
In-stock
Samtec Inc. CONN IC DIP SOCKET 16POS TIN ICO Active Bulk -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyester, Glass Filled 0.100" (2.54mm) Tin - Tin 16 (2 x 8) Beryllium Copper - Brass
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1,514
In-stock
Samtec Inc. CONN IC DIP SOCKET 14POS TIN ICO Active Bulk -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyester, Glass Filled 0.100" (2.54mm) Tin - Tin 14 (2 x 7) Beryllium Copper - Brass
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1,130
In-stock
Samtec Inc. CONN IC DIP SOCKET 8POS GOLD ICO Active Bulk -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyester, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 8 (2 x 4) Beryllium Copper - Brass
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3,215
In-stock
Samtec Inc. CONN IC DIP SOCKET 32POS GOLD ICO Active Bulk -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyester, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 32 (2 x 16) Beryllium Copper - Brass
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3,132
In-stock
Samtec Inc. CONN IC DIP SOCKET 40POS GOLD ICO Active Bulk -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyester, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 40 (2 x 20) Beryllium Copper - Brass
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RFQ
3,908
In-stock
Samtec Inc. CONN IC DIP SOCKET 28POS GOLD ICO Active Bulk -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyester, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 28 (2 x 14) Beryllium Copper - Brass
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913
In-stock
Samtec Inc. CONN IC DIP SOCKET 40POS GOLD ICO Active Bulk -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyester, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 40 (2 x 20) Beryllium Copper - Brass
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1,766
In-stock
Samtec Inc. CONN IC DIP SOCKET 40POS GOLD ICA Active Bulk -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyester, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 40 (2 x 20) Beryllium Copper 30.0µin (0.76µm) Brass
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2,045
In-stock
Samtec Inc. CONN IC DIP SOCKET 24POS GOLD ICO Active Bulk -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyester, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 24 (2 x 12) Beryllium Copper - Brass
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801
In-stock
Samtec Inc. CONN IC DIP SOCKET 16POS GOLD ICA Active Bulk -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyester, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 16 (2 x 8) Beryllium Copper 10.0µin (0.25µm) Brass
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RFQ
1,847
In-stock
Samtec Inc. CONN IC DIP SOCKET 28POS GOLD ICA Active Bulk -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyester, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 28 (2 x 14) Beryllium Copper 30.0µin (0.76µm) Brass
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2,165
In-stock
Samtec Inc. CONN IC DIP SOCKET 16POS GOLD ICA Active Bulk -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyester, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 16 (2 x 8) Beryllium Copper 10.0µin (0.25µm) Brass
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3,251
In-stock
Samtec Inc. CONN IC DIP SOCKET 18POS GOLD ICA Active Bulk -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyester, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 18 (2 x 9) Beryllium Copper 30.0µin (0.76µm) Brass
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RFQ
2,340
In-stock
Samtec Inc. CONN IC DIP SOCKET 8POS GOLD ICA Active Bulk -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyester, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 8 (2 x 4) Beryllium Copper - Brass
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RFQ
1,495
In-stock
Samtec Inc. CONN IC DIP SOCKET 14POS GOLD ICO Active Bulk -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyester, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 14 (2 x 7) Beryllium Copper - Brass
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3,801
In-stock
Samtec Inc. CONN IC DIP SOCKET 16POS TIN ICO Active Bulk -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyester, Glass Filled 0.100" (2.54mm) Tin - Tin 16 (2 x 8) Beryllium Copper - Brass
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RFQ
1,558
In-stock
Samtec Inc. CONN IC DIP SOCKET 8POS TIN ICA Active Bulk -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyester, Glass Filled 0.100" (2.54mm) Tin - Tin 8 (2 x 4) Beryllium Copper - Brass
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RFQ
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RFQ
2,782
In-stock
Samtec Inc. CONN IC DIP SOCKET 8POS TIN ICO Active Bulk -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyester, Glass Filled 0.100" (2.54mm) Tin - Tin 8 (2 x 4) Beryllium Copper - Brass
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RFQ
3,662
In-stock
Samtec Inc. CONN IC DIP SOCKET 8POS GOLD ICA Active Bulk -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyester, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 8 (2 x 4) Beryllium Copper 30.0µin (0.76µm) Brass
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RFQ
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RFQ
2,377
In-stock
Samtec Inc. CONN IC DIP SOCKET 8POS GOLD ICO Active Bulk -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyester, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 8 (2 x 4) Beryllium Copper - Brass
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2,296
In-stock
Samtec Inc. CONN IC DIP SOCKET 14POS TIN ICO Active Bulk -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyester, Glass Filled 0.100" (2.54mm) Tin - Tin 14 (2 x 7) Beryllium Copper - Brass
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RFQ
1,993
In-stock
Samtec Inc. CONN IC DIP SOCKET 16POS GOLD ICO Active Bulk -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyester, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 16 (2 x 8) Beryllium Copper - Brass
MS05
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1,072
In-stock
Apex Microtechnology CONN IC DIP SOCKET 12POS GOLD Apex Precision Power® Active Bulk - Through Hole Solder Open Frame DIP, 1.2" (30.48mm) Row Spacing Polyester, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 12 (2 x 6) Beryllium Copper 200.0µin (5.08µm) Brass
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1,049
In-stock
Samtec Inc. CONN IC DIP SOCKET 8POS TIN ICO Active Bulk -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyester, Glass Filled 0.100" (2.54mm) Tin - Tin 8 (2 x 4) Beryllium Copper - Brass
ICA-308-SGT
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1,996
In-stock
Samtec Inc. CONN IC DIP SOCKET 8POS GOLD ICA Active Bulk -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyester, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 8 (2 x 4) Beryllium Copper 10.0µin (0.25µm) Brass